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MSP430F47126IPZ

Texas Instruments

MSP430F47126IPZ by Texas Instruments

MSP430F47126IPZ by Texas Instruments is a 16-bit microcontroller with 57344 ROM words, 4 RAM words, and 6-Ch 12-Bit ADC channels. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities. Features include 7 timers, multiple serial I/Os, and connectivity options like I2C, SPI, and UART.

Median Price

$8.264

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,540 parts In-Stock

1+ parts

$9.697

100+ parts

$7.905

1k+ parts

$5.270

10k+ parts

-

1,540

$9.697

$7.905

$5.270

-

Rochester

USA . 8 parts In-Stock

1+ parts

-

100+ parts

$6.830

1k+ parts

$6.110

10k+ parts

$5.750

8

-

$6.830

$6.110

$5.750

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,463 parts In-Stock

1+ parts

$6.954

100+ parts

-

1k+ parts

-

10k+ parts

-

3,463

$6.954

-

-

-

Vyrian

USA . 2,590 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,590

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,765 parts In-Stock

1+ parts

$6.588

100+ parts

-

1k+ parts

-

10k+ parts

-

3,765

$6.588

-

-

-

AZTECH Wire

Italy . 799 parts In-Stock

1+ parts

$11.360

100+ parts

-

1k+ parts

-

10k+ parts

-

799

$11.360

-

-

-

Microchip USA

USA . 2,907 parts In-Stock

1+ parts

$24.290

100+ parts

$23.950

1k+ parts

$23.770

10k+ parts

$23.600

2,907

$24.290

$23.950

$23.770

$23.600

Parana Technologies

USA . 915 parts In-Stock

1+ parts

$67.337

100+ parts

$6,253.299

1k+ parts

$60.604

10k+ parts

-

915

$67.337

$6,253.299

$60.604

-

DigiPath Technology Company

USA . 1,283 parts In-Stock

1+ parts

$74.147

100+ parts

-

1k+ parts

-

10k+ parts

-

1,283

$74.147

-

-

-

ChromeModa Solutions

Germany . 4,542 parts In-Stock

1+ parts

$75.660

100+ parts

$62.041

1k+ parts

-

10k+ parts

-

4,542

$75.660

$62.041

-

-

IDEA Electronic Components Group

UK . 272 parts In-Stock

1+ parts

$75.660

100+ parts

$71.877

1k+ parts

$68.094

10k+ parts

-

272

$75.660

$71.877

$68.094

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QUARKTWIN TECHNOLOGY LTD

USA . 28,945 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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28,945

-

-

-

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Perfect Parts

USA . 96 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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96

-

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Overview

Unlock the potential of your projects with the Texas Instruments MSP430F47126IPZ microcontroller. This powerful device, part of the renowned MSP430 family, offers unparalleled quality and versatility for a wide range of applications. With advanced features like multiple ADC and DMA channels, along with low power modes, this microcontroller provides exceptional value and performance. Trust in Texas Instruments' expertise in the industry to deliver reliable solutions that meet your needs. Let the MSP430F47126IPZ elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for easy handling and protection of the microcontroller.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options while ensuring safe operation of the microcontroller.

CPU Family: MSP430

Known for its low power consumption and high performance, making it suitable for a wide range of applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables efficient processing and execution of instructions, enhancing overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-powered applications.

Analog To Digital Convertors: 6-Ch 12-Bit

Multiple ADC channels with high resolution provide accurate conversion of analog signals, essential for sensor interfacing.

Connectivity: I2C, IRDA(2), LIN(2), SCI(4), SPI(4), UART(2)

Versatile communication interfaces for connecting with various peripherals and devices, increasing flexibility in system design.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the microcontroller, enabling firmware updates and customization.

Low Power Mode: YES

Supports low power operation, extending battery life and reducing energy consumption in portable and IoT applications.

Technical Specifications

Microcontrollers MSP430F47126IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES 4.15MHZ AT MINI 1.8V

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

72

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

57344

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(2), LIN(2), SCI(4), SPI(4), UART(2)"

Peripherals:

"BOD, COMPARATOR(2), DMA(3), RTC, TIMER(7), WDT"

Analog To Digital Convertors:

6-Ch 12-Bit

Trade Compliance

MSP430F47126IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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