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MSP430F249MPMEP

Texas Instruments

MSP430F249MPMEP by Texas Instruments

MSP430F249MPMEP by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at a max frequency of 16 MHz. It features 8 ADC channels and offers low power mode, making it ideal for applications requiring high-speed processing and efficient power consumption. With peripherals like BOR, comparator, and multiple timers, this CMOS technology-based microcontroller is suitable for military-grade temperature environments.

Median Price

$15.262

Lifecycle Status

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19

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1k+

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Chip1Stop

Japan . 115 parts In-Stock

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$12.100

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Arrow

USA . 2 parts In-Stock

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$13.870

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$13.870

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Verical

USA . 2 parts In-Stock

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$13.870

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Texas Instruments

USA . 2,358 parts In-Stock

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$16.653

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$14.546

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$10.032

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Mouser Electronics

USA . 152 parts In-Stock

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$23.760

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$16.470

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$15.750

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DigiKey

USA . 313 parts In-Stock

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$24.030

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$18.108

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$16.044

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$16.044

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Distributors (In-Stock)

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Digiode

USA . 3,230 parts In-Stock

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$10.618

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$10.618

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Ozdisan Elektronik

Türkiye . 30 parts In-Stock

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$12.856

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Nova Conductors

Japan . 300 parts In-Stock

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$16.050

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Vyrian

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Chip Stock

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PC Components Company LLC

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Bristol Electronics

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Cyclops Electronics Ltd

UK . 37 parts In-Stock

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Resion

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NAC Semi

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$37.720

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North Shore Components

USA . 21 parts In-Stock

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Cogito LLC

Ukraine . 5 parts In-Stock

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Microfarads

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Ampacity Inc.

Singapore . 402 parts In-Stock

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$9.500

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$9.500

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Semicontronic

India . 356 parts In-Stock

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$9.500

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$9.262

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$9.215

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$9.500

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Corphita

USA . 1,912 parts In-Stock

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$10.059

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Parana Technologies

USA . 1,420 parts In-Stock

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$14.123

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$14.586

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DigiPath Technology Company

USA . 1,021 parts In-Stock

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$15.551

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$14.307

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Aranea Global

USA . 1,000 parts In-Stock

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$15.729

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$15.100

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$15.729

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ChromeModa Solutions

Germany . 3,086 parts In-Stock

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$15.868

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$13.012

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IDEA Electronic Components Group

UK . 1,355 parts In-Stock

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$15.075

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$14.281

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Continental Prestige Electronics

USA . 2,486 parts In-Stock

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$21.192

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$19.285

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Corohmni

South Africa . 677 parts In-Stock

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Microchip USA

USA . 2,948 parts In-Stock

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$53.990

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$53.590

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$53.200

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Lixinc

USA . 16,404 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,752 parts In-Stock

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Argo Parts USA

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Unlock the limitless possibilities of technology with the Texas Instruments MSP430F249MPMEP microcontroller. Crafted with precision and expertise, this powerful device offers unrivaled performance and reliability in a compact package. Ideal for a wide range of applications, from IoT devices to industrial automation, this microcontroller boasts advanced features such as low power consumption, high-speed processing, and a plethora of peripherals including ADC channels and PWM channels. Experience seamless connectivity with I2C, LIN, SPI, UART, and more. Trust Texas Instruments for cutting-edge solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for a variety of environments.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, giving users more choices for their applications.

Minimum Operating Temperature: -55 °C

Ensures functionality even in extreme cold temperatures, making it suitable for a wide range of operating conditions.

ADC Channels: YES

Ability to convert analog signals to digital data, allowing for more precise measurements and sensor readings.

ROM Programmability: FLASH

Enables users to reprogram and update the microcontroller with new firmware, providing flexibility and adaptability for different applications.

Connectivity: I2C, IRDA(2), LIN(2), SPI(4), UART(2), USCI(2)

Multiple communication interfaces support easy connectivity with various devices and peripherals, enhancing the microcontroller's versatility.

Low Power Mode: YES

Allows for power-efficient operation, making the microcontroller suitable for battery-powered devices or energy-conscious applications.

Technical Specifications

Microcontrollers MSP430F249MPMEP attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.449 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA(2), LIN(2), SPI(4), UART(2), USCI(2)

Peripherals:

BOR, COMPARATOR, TIMER(20), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430F249MPMEP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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