Loading...

MSP430F233TRGCT

Texas Instruments

MSP430F233TRGCT by Texas Instruments

MSP430F233TRGCT by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 8192 ROM words. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption. Featuring 8-channel 12-bit ADCs and various peripherals like BOD, TIMER(6), it offers connectivity options such as I2C, SPI(2), UART for versatile usage.

Median Price

$4.804

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 750 parts In-Stock

1+ parts

$4.858

100+ parts

$3.960

1k+ parts

$2.640

10k+ parts

-

750

$4.858

$3.960

$2.640

-

Rochester

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$3.800

1k+ parts

$3.400

10k+ parts

$3.200

500

-

$3.800

$3.400

$3.200

DigiKey

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$5.000

1k+ parts

-

10k+ parts

-

500

-

$5.000

-

-

Verical

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$4.750

1k+ parts

$4.250

10k+ parts

$4.000

500

-

$4.750

$4.250

$4.000

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,574 parts In-Stock

1+ parts

$3.486

100+ parts

-

1k+ parts

-

10k+ parts

-

3,574

$3.486

-

-

-

Vyrian

USA . 8,477 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,477

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,012 parts In-Stock

1+ parts

$3.303

100+ parts

-

1k+ parts

-

10k+ parts

-

1,012

$3.303

-

-

-

Microchip USA

USA . 1,983 parts In-Stock

1+ parts

$29.460

100+ parts

$29.280

1k+ parts

$29.190

10k+ parts

$29.100

1,983

$29.460

$29.280

$29.190

$29.100

Parana Technologies

USA . 964 parts In-Stock

1+ parts

$53.208

100+ parts

-

1k+ parts

-

10k+ parts

-

964

$53.208

-

-

-

ChromeModa Solutions

Germany . 4,997 parts In-Stock

1+ parts

$59.784

100+ parts

$49.023

1k+ parts

-

10k+ parts

-

4,997

$59.784

$49.023

-

-

IDEA Electronic Components Group

UK . 2,206 parts In-Stock

1+ parts

$59.784

100+ parts

$56.795

1k+ parts

$53.806

10k+ parts

-

2,206

$59.784

$56.795

$53.806

-

DigiPath Technology Company

USA . 2,188 parts In-Stock

1+ parts

-

100+ parts

$53.901

1k+ parts

-

10k+ parts

-

2,188

-

$53.901

-

-

Overview

Experience the cutting-edge technology of the Texas Instruments MSP430F233TRGCT microcontroller. With its high-quality manufacturing and innovative design, this microcontroller offers unparalleled performance in a wide range of applications. From industrial automation to consumer electronics, the MSP430F233TRGCT provides value, efficiency, and reliability. Trust Texas Instruments to deliver top-of-the-line products that meet your needs and exceed your expectations. Elevate your projects with the MSP430F233TRGCT and experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 3.6 V

Supports a wide range of input voltages, making it versatile for different applications.

On Chip Data RAM Width: 8

8-bit data RAM width allows for efficient data processing and storage.

Package Shape: SQUARE

Square package shape provides a compact and space-saving design.

Bit Size: 16

16-bit architecture allows for higher processing speeds and more complex operations.

Power Supplies (V): 2/3.3

Supports multiple power supply options for flexibility in power management.

No. of Terminals: 64

Plenty of terminals for interfacing with external components and peripherals.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Provides a thin profile for space-constrained applications and easy integration.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage for efficient power consumption and extended battery life.

Maximum Operating Temperature: 105 °C

Wide operating temperature range suitable for industrial environments.

CPU Family: MSP430

Part of the MSP430 family known for low power consumption and high performance.

Minimum Operating Temperature: -40 °C

Operates reliably in extreme cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Durable and reliable terminal finish for long-term use.

ADC Channels: YES

Built-in analog to digital converters for interfacing with analog sensors and signals.

Terminal Position: QUAD

Quad terminal position for easy soldering and secure connections.

ROM Words: 8192

Ample ROM storage capacity for program code and data storage.

Maximum Seated Height: 1 mm

Low seated height for compact and slim device designs.

Width: 9 mm

Narrow width for space-saving PCB layouts.

Boundary Scan: YES

Boundary scan capability for enhanced testing and debugging of PCBs.

Peripherals: "BOD, COMPARATOR, TIMER(6), WDT

Various built-in peripherals for enhanced functionality and performance.

Maximum Clock Frequency: 16 MHz

Supports high clock frequencies for fast data processing and real-time applications.

Peak Reflow Temperature °C: 260

High peak reflow temperature for reliable soldering during PCB assembly.

Length: 9 mm

Compact length for space-efficient device designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for rugged and reliable operation.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient data processing and low power consumption.

No. of Timers: 6

Multiple timers for precise timing and control of operations.

RAM Bytes: 1024

Sufficient RAM storage for data processing and temporary storage.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: NO LEAD

Lead-free terminal form for environmental friendliness and compliance with regulations.

Analog To Digital Convertors: 8-Ch 12-Bit

8-channel 12-bit ADC for high-resolution analog signal conversion.

Nominal Supply Voltage: 3 V

Stable and reliable nominal supply voltage for consistent performance.

No. of Serial I/Os: 4

Multiple serial I/O ports for communication with external devices.

PWM Channels: YES

Pulse width modulation (PWM) channels for precise control of analog outputs.

Connectivity: "I2C, IRDA, LIN, SPI(2), UART, USCI(2)

Versatile connectivity options for interfacing with a wide range of devices and peripherals.

ROM Programmability: FLASH

Flash ROM programmability for easy and efficient firmware updates.

Terminal Pitch: 0.5 mm

Fine pitch terminals for high-density PCB layouts and compact designs.

Format: FIXED POINT

Fixed point data format for efficient numerical calculations and operations.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating for safe and reliable reflow soldering during PCB assembly.

Speed: 16 rpm

Operates at 16 revolutions per minute for precise timing applications.

Low Power Mode: YES

Low power mode for energy-efficient operation and extended battery life.

On Chip Program ROM Width: 8

8-bit on-chip program ROM width for efficient program storage and execution.

No. of I/O Lines: 48

Plenty of I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers MSP430F233TRGCT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR, TIMER(6), WDT"

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430F233TRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20