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MSP430F2330TRHAT

Texas Instruments

MSP430F2330TRHAT by Texas Instruments

MSP430F2330TRHAT by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 8192 ROM words. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption. Features include PWM channels, I2C, IRDA, LIN connectivity, and on-chip peripherals like BOD and timers.

Median Price

$5.798

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,000 parts In-Stock

1+ parts

$6.545

100+ parts

$5.735

1k+ parts

$3.240

10k+ parts

-

5,000

$6.545

$5.735

$3.240

-

DigiKey

USA . 192 parts In-Stock

1+ parts

$8.580

100+ parts

$5.654

1k+ parts

$5.402

10k+ parts

-

192

$8.580

$5.654

$5.402

-

Rochester

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$4.050

1k+ parts

$3.620

10k+ parts

$3.410

250

-

$4.050

$3.620

$3.410

Verical

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$5.050

1k+ parts

$4.513

10k+ parts

$4.250

250

-

$5.050

$4.513

$4.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,018 parts In-Stock

1+ parts

$4.275

100+ parts

-

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-

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2,018

$4.275

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$4.460

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$4.460

-

-

-

Vyrian

USA . 3,195 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,195

-

-

-

-

Chip Stock

USA . 775 parts In-Stock

1+ parts

-

100+ parts

-

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775

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,220 parts In-Stock

1+ parts

$3.820

100+ parts

$3.724

1k+ parts

$3.705

10k+ parts

-

1,220

$3.820

$3.724

$3.705

-

Ampacity Inc.

Singapore . 967 parts In-Stock

1+ parts

$3.820

100+ parts

-

1k+ parts

-

10k+ parts

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967

$3.820

-

-

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Corphita

USA . 2,866 parts In-Stock

1+ parts

$4.050

100+ parts

-

1k+ parts

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10k+ parts

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2,866

$4.050

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-

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$4.371

100+ parts

-

1k+ parts

$4.196

10k+ parts

-

50

$4.371

-

$4.196

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Continental Prestige Electronics

USA . 3,609 parts In-Stock

1+ parts

$4.460

100+ parts

-

1k+ parts

-

10k+ parts

$4.371

3,609

$4.460

-

-

$4.371

Argo Parts USA

USA . 507 parts In-Stock

1+ parts

$4.460

100+ parts

-

1k+ parts

-

10k+ parts

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507

$4.460

-

-

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Advanced Electronics

New Zealand . 650 parts In-Stock

1+ parts

$4.549

100+ parts

$4.549

1k+ parts

$4.549

10k+ parts

-

650

$4.549

$4.549

$4.549

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Corohmni

South Africa . 514 parts In-Stock

1+ parts

$4.854

100+ parts

-

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-

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514

$4.854

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-

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Parana Technologies

USA . 562 parts In-Stock

1+ parts

$65.129

100+ parts

-

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562

$65.129

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-

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ChromeModa Solutions

Germany . 6,785 parts In-Stock

1+ parts

$73.179

100+ parts

$60.007

1k+ parts

-

10k+ parts

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6,785

$73.179

$60.007

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IDEA Electronic Components Group

UK . 2,034 parts In-Stock

1+ parts

$73.179

100+ parts

$69.520

1k+ parts

$65.861

10k+ parts

-

2,034

$73.179

$69.520

$65.861

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DigiPath Technology Company

USA . 1,408 parts In-Stock

1+ parts

-

100+ parts

$65.978

1k+ parts

-

10k+ parts

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1,408

-

$65.978

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F2330TRHAT microcontroller. Crafted with precision and expertise, this cutting-edge device offers unmatched performance and reliability in a compact package. Ideal for a wide range of applications, this versatile microcontroller delivers exceptional value and efficiency to customers seeking top-of-the-line technology. Elevate your projects to new heights with the MSP430F2330TRHAT and experience the difference of quality engineering at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers as it provides a good balance of durability and cost-effectiveness.

Surface Mount: YES

Surface mount technology allows for compact size and easy integration into electronic circuits.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage allows for flexibility in power supply design.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and storage capabilities.

Package Shape: SQUARE

Square packages are easier to handle and provide uniformity in circuit board design.

Bit Size: 16

A 16-bit architecture allows for more complex operations and calculations compared to lower bit sizes.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages gives flexibility in power management and compatibility with different systems.

No. of Terminals: 40

Having a sufficient number of terminals allows for connectivity with various external devices and peripherals.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage enables efficient power consumption and operation in low-power applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliability in a wide range of environmental conditions.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and high performance, making it a popular choice for battery-powered applications.

ADC Channels: YES

Having ADC channels enables the microcontroller to convert analog signals to digital data for processing.

ROM Words: 8192

The large ROM capacity allows for storing program instructions and data, making the microcontroller versatile and capable of handling complex tasks.

Width: 6 mm

Compact width makes the microcontroller suitable for space-constrained designs.

Maximum Clock Frequency: 16 MHz

A high clock frequency allows for fast execution of instructions and efficient data processing.

Peripheral IC Type: MICROCONTROLLER, RISC

A RISC architecture enhances processing speed and efficiency, making the microcontroller suitable for real-time applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

No. of Timers: 2

Multiple timers enable precise timing and scheduling of tasks in applications requiring time-dependent operations.

RAM Bytes: 1024

A sufficient RAM capacity allows for temporary data storage and efficient multitasking capability.

PWM Channels: YES

Support for PWM channels enables precise control of analog signals, making the microcontroller suitable for motor control and power management applications.

Connectivity: I2C, IRDA, LIN, SCI(2), SPI(2), UART

Multiple connectivity options allow the microcontroller to communicate with various devices and systems, expanding its versatility and compatibility.

ROM Programmability: FLASH

Flash programmability enables easy and fast updates to the microcontroller's program code, facilitating firmware upgrades and customization.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the microcontroller can withstand moderate exposure to moisture during storage and handling.

Low Power Mode: YES

The low power mode allows the microcontroller to reduce power consumption during idle or low activity periods, prolonging battery life in portable devices.

Technical Specifications

Microcontrollers MSP430F2330TRHAT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

1

No. of Terminals:

40

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SCI(2), SPI(2), UART"

Peripherals:

"BOD, COMPARATOR, TIMER(2), WDT"

Trade Compliance

MSP430F2330TRHAT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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