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MSP430F2274TDA

Texas Instruments

MSP430F2274TDA by Texas Instruments

MSP430F2274TDA by Texas Instruments is a 16-bit microcontroller with a max clock frequency of 16 MHz. It features 32 I/O lines, 1024 bytes of RAM, and 32768 ROM words. This microcontroller is commonly used in industrial applications due to its low power mode and connectivity options such as I2C, SPI, UART, and more.

Median Price

$7.120

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,390 parts In-Stock

1+ parts

$5.251

100+ parts

$4.281

1k+ parts

$2.854

10k+ parts

-

7,390

$5.251

$4.281

$2.854

-

DigiKey

USA . 152 parts In-Stock

1+ parts

$7.120

100+ parts

$4.910

1k+ parts

$4.187

10k+ parts

-

152

$7.120

$4.910

$4.187

-

Mouser Electronics

USA . 75 parts In-Stock

1+ parts

$7.120

100+ parts

$4.920

1k+ parts

$4.180

10k+ parts

-

75

$7.120

$4.920

$4.180

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$4.491

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$4.491

-

-

-

Digiode

USA . 3,637 parts In-Stock

1+ parts

$4.988

100+ parts

-

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-

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-

3,637

$4.988

-

-

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Vyrian

USA . 2,413 parts In-Stock

1+ parts

-

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-

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2,413

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,435 parts In-Stock

1+ parts

$4.116

100+ parts

-

1k+ parts

-

10k+ parts

$4.034

6,435

$4.116

-

-

$4.034

Argo Parts USA

USA . 3,421 parts In-Stock

1+ parts

$4.116

100+ parts

-

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-

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3,421

$4.116

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-

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$4.401

100+ parts

-

1k+ parts

$4.225

10k+ parts

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500

$4.401

-

$4.225

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Ampacity Inc.

Singapore . 2,215 parts In-Stock

1+ parts

$4.460

100+ parts

-

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2,215

$4.460

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Semicontronic

India . 2,151 parts In-Stock

1+ parts

$4.460

100+ parts

$4.348

1k+ parts

$4.326

10k+ parts

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2,151

$4.460

$4.348

$4.326

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Corphita

USA . 881 parts In-Stock

1+ parts

$4.726

100+ parts

-

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881

$4.726

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Component Stockers USA

USA . 9,534 parts In-Stock

1+ parts

$6.700

100+ parts

$5.890

1k+ parts

$3.060

10k+ parts

-

9,534

$6.700

$5.890

$3.060

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Parana Technologies

USA . 1,771 parts In-Stock

1+ parts

$34.064

100+ parts

-

1k+ parts

$140.730

10k+ parts

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1,771

$34.064

-

$140.730

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DigiPath Technology Company

USA . 478 parts In-Stock

1+ parts

$37.509

100+ parts

$34.508

1k+ parts

-

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478

$37.509

$34.508

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ChromeModa Solutions

Germany . 3,783 parts In-Stock

1+ parts

$38.274

100+ parts

$31.385

1k+ parts

-

10k+ parts

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3,783

$38.274

$31.385

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IDEA Electronic Components Group

UK . 568 parts In-Stock

1+ parts

$38.274

100+ parts

$36.360

1k+ parts

$34.447

10k+ parts

-

568

$38.274

$36.360

$34.447

-

Aztec Data Supply Inc.

USA . 287 parts In-Stock

1+ parts

$62.270

100+ parts

-

1k+ parts

-

10k+ parts

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287

$62.270

-

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

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7,000

-

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Lixinc

USA . 2,879 parts In-Stock

1+ parts

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2,879

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Perfect Parts

USA . 230 parts In-Stock

1+ parts

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230

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Overview

Discover the MSP430F2274TDA, a high-quality microcontroller from Texas Instruments. With its small outline and thin profile package style, this versatile device is perfect for a wide range of applications. Whether you're working on IoT projects, sensor networks, or industrial automation systems, the MSP430F2274TDA delivers exceptional performance and reliability. With features like low power mode and a maximum clock frequency of 16 MHz, this microcontroller offers incredible value for customers seeking efficiency and functionality. Experience the benefits of connectivity options such as I2C, SPI, UART, and more, providing seamless integration with other devices. Trust in Texas Instruments' reputation for manufacturing excellence and choose the MSP430F2274TDA for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, reducing overall production costs.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power sources.

On Chip Data RAM Width: 8

The 8-bit data RAM width allows for efficient data processing and storage within the microcontroller.

Package Shape: RECTANGULAR

Rectangular shape helps in easy placement and orientation of the microcontroller on the PCB.

Bit Size: 16

16-bit architecture provides higher processing capabilities and allows for more complex calculations.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages gives flexibility in design and compatibility with different power sources.

No. of Terminals: 38

Having a higher number of terminals allows for more I/O options and connectivity with external devices.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space on the PCB and enables efficient use of board real estate.

Minimum Supply Voltage: 3.3 V

Low minimum supply voltage ensures compatibility with a wide range of power sources without compromising performance.

Maximum Operating Temperature: 105 °C

High maximum operating temperature allows for reliable operation even in harsh industrial environments.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it an ideal choice for energy-efficient applications.

Minimum Operating Temperature: -40 °C

Extreme minimum operating temperature range enables use in very cold environments without sacrificing functionality.

ADC Channels: YES

Having ADC channels allows for analog signal input processing and conversion, making the microcontroller versatile for sensor interfacing.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Ni/Pd/Au terminal finish provides good conductivity, corrosion resistance, and longevity for stable connections.

ROM Words: 32768

Large ROM word capacity allows for storing a significant amount of program instructions and data for complex applications.

Maximum Seated Height: 1.2 mm

Low seated height ensures compatibility with slim and compact device designs, saving space in the overall product.

Width: 6.1 mm

Narrow width enables efficient placement on the PCB and facilitates a compact overall circuit design.

Boundary Scan: YES

Boundary scan capability allows for easy testing and debugging of the microcontroller during production and in the field.

Peripherals: "BOD, COMPARATOR(8), TIMER(6), WDT

A variety of built-in peripherals enhance the microcontroller's functionality and enable versatile application usage.

Maximum Clock Frequency: 16 MHz

High clock frequency enables fast data processing and execution of instructions, suitable for real-time applications.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable soldering during PCB assembly without damaging the microcontroller.

Length: 12.5 mm

Compact length facilitates efficient PCB layout and space-saving designs for small form factor products.

Temperature Grade: INDUSTRIAL

Industrial temperature grade means the microcontroller is suitable for use in rugged environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers efficient data processing, reduced power consumption, and faster execution times.

No. of Timers: 6

Multiple timers provide precise timing control for various functions and applications, enhancing the microcontroller's versatility.

RAM Bytes: 1024

Having 1024 bytes of RAM allows temporary data storage for efficient program execution and multitasking capabilities.

Technology: BIPOLAR

Bipolar technology offers high-speed operation and precise signal processing, well-suited for demanding applications.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder joints and easy PCB assembly, ensuring reliable electrical connections.

Analog To Digital Convertors: 12-Ch 10-Bit

Multiple ADC channels with 10-bit resolution enable accurate conversion of analog signals to digital data for sensor interfacing.

Maximum Supply Current: 0.55 mA

Low maximum supply current ensures energy-efficient operation, making the product suitable for battery-powered applications.

Nominal Supply Voltage: 2.2 V

Stable nominal supply voltage ensures consistent operation and compatibility with low-power applications.

No. of Serial I/Os: 2

Serial I/Os provide communication interfaces for connecting to external devices, enabling data transfer and control functions.

PWM Channels: YES

PWM channels enable precise control of analog signals, making the microcontroller suitable for motor control and power regulation applications.

Connectivity: "I2C, IRDA, LIN, SPI(2), UART, USCI(2)

Multiple connectivity options allow for easy integration with various communication protocols and devices, enhancing the product's versatility.

ROM Programmability: FLASH

Flash ROM programmability enables easy and quick updates to the microcontroller's firmware, facilitating firmware upgrades and bug fixes.

Terminal Pitch: 0.65 mm

Narrow terminal pitch simplifies PCB layout and provides high-density mounting options for compact designs.

Format: FIXED POINT

Fixed-point format ensures accurate mathematical calculations and simplifies implementation of algorithms, suitable for signal processing tasks.

Moisture Sensitivity Level (MSL): 2

MSL level 2 signifies the microcontroller is resistant to moisture, making it suitable for use in humid or damp environments.

Speed: 16 rpm

High processing speed of 16 rpm allows for quick data processing and efficient execution of tasks, suitable for real-time applications.

Low Power Mode: YES

Low power mode functionality allows for energy-efficient operation, prolonging battery life and reducing power consumption.

On Chip Program ROM Width: 8

8-bit program ROM width enables storage of instructions for efficient program execution and memory usage optimization.

No. of I/O Lines: 32

Having 32 I/O lines provides flexibility in interfacing with external devices and peripherals, making the microcontroller versatile for various applications.

Technical Specifications

Microcontrollers MSP430F2274TDA attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

32

No. of Serial I/Os:

2

No. of Terminals:

38

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), TIMER(6), WDT"

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F2274TDA Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-577-6001, 5962015776001

NIIN

015776001

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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