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MSP430F2274MRHATEP

Texas Instruments

MSP430F2274MRHATEP by Texas Instruments

MSP430F2274MRHATEP by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 32768 ROM words. It operates at a max clock frequency of 16 MHz, has 12-Ch 10-Bit ADC channels, and features low power mode. Ideal for military applications due to its temperature grade and boundary scan capability.

Median Price

$14.100

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

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Farnell

UK . 500 parts In-Stock

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$11.590

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$8.010

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$11.590

$8.010

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Texas Instruments

USA . 42,944 parts In-Stock

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$13.728

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$11.992

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$8.270

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$13.728

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$8.270

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Arrow

USA . 1 parts In-Stock

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$14.100

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$14.100

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Verical

USA . 1 parts In-Stock

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$14.100

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DigiKey

USA . 1,019 parts In-Stock

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$21.740

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$15.116

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$14.205

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1,019

$21.740

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$14.205

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Mouser Electronics

USA . 745 parts In-Stock

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$21.740

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$15.120

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$14.200

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745

$21.740

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$14.200

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Element14

Singapore . 180 parts In-Stock

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$15.700

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$15.700

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Distributors (In-Stock)

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Vyrian

USA . 3,201 parts In-Stock

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$10.860

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$10.860

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Digiode

USA . 1,022 parts In-Stock

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$13.042

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QIE Inc.

USA . 250 parts In-Stock

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Bristol Electronics

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Atlantic Semiconductor

USA . 121 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 15 parts In-Stock

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Inventory MP

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Prism Electronics

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PC Components Company LLC

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Distributors (Availability)

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Continental Prestige Electronics

USA . 234 parts In-Stock

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$11.260

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$8.740

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$8.740

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Corphita

USA . 4,239 parts In-Stock

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$12.355

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Parana Technologies

USA . 1,539 parts In-Stock

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$24.479

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$25.146

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ChromeModa Solutions

Germany . 2,659 parts In-Stock

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$27.505

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$22.554

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IDEA Electronic Components Group

UK . 965 parts In-Stock

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$27.505

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$26.130

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$24.754

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Microchip USA

USA . 2,971 parts In-Stock

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Lixinc

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Perfect Parts

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Authorized Procurement Solutions

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DigiPath Technology Company

USA . 235 parts In-Stock

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$24.799

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Kepictronics

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Cyclops Electronics Ltd (Excess)

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Overview

Unleash the power of cutting-edge technology with the MSP430F2274MRHATEP microcontroller by Texas Instruments. Boasting top-notch quality and reliability, this product offers unparalleled performance in a wide range of applications. From industrial automation to consumer electronics, this versatile device is designed to meet all your needs with ease. Experience seamless connectivity and ultra-low power consumption, making it the perfect choice for your next project. Elevate your designs with the MSP430F2274MRHATEP and discover the true meaning of innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Can operate at higher voltage levels, providing flexibility in different applications.

On Chip Data RAM Width: 8

Having a wider data RAM allows for efficient data processing and storage.

Bit Size: 16

Provides a good balance between processing power and power consumption.

Power Supplies (V): 2/3.3

Supports multiple power supply options for compatibility with various systems.

No. of Terminals: 40

Offers a sufficient number of terminals for connectivity and interfacing with other components.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling precise measurement and control of analog signals.

ROM Words: 32768

Large ROM capacity for storing program instructions and data.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments, suitable for industrial applications.

Technical Specifications

Microcontrollers MSP430F2274MRHATEP attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

1

No. of Terminals:

40

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, LIN, SPI(2), UART, USCI(2)

Peripherals:

BOR, TIMER(6), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F2274MRHATEP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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