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MSP430F2254TRHAR

Texas Instruments

MSP430F2254TRHAR by Texas Instruments

MSP430F2254TRHAR by Texas Instruments is a 16-bit microcontroller with 32 I/O lines, 12-Ch 10-Bit ADC channels, and 6 timers. It operates at a max clock frequency of 16 MHz and has low power mode capabilities. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$4.431

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,175 parts In-Stock

1+ parts

$4.431

100+ parts

$3.612

1k+ parts

$2.408

10k+ parts

-

9,175

$4.431

$3.612

$2.408

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,516 parts In-Stock

1+ parts

$4.209

100+ parts

-

1k+ parts

-

10k+ parts

-

1,516

$4.209

-

-

-

Vyrian

USA . 7,273 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,273

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,271 parts In-Stock

1+ parts

$3.988

100+ parts

-

1k+ parts

-

10k+ parts

-

1,271

$3.988

-

-

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AZTECH Wire

Italy . 465 parts In-Stock

1+ parts

$14.850

100+ parts

-

1k+ parts

-

10k+ parts

-

465

$14.850

-

-

-

Microchip USA

USA . 2,029 parts In-Stock

1+ parts

$21.030

100+ parts

$20.900

1k+ parts

$20.830

10k+ parts

$20.770

2,029

$21.030

$20.900

$20.830

$20.770

Parana Technologies

USA . 1,156 parts In-Stock

1+ parts

$23.362

100+ parts

-

1k+ parts

$23.999

10k+ parts

-

1,156

$23.362

-

$23.999

-

DigiPath Technology Company

USA . 71 parts In-Stock

1+ parts

$25.724

100+ parts

$23.666

1k+ parts

-

10k+ parts

-

71

$25.724

$23.666

-

-

IDEA Electronic Components Group

UK . 811 parts In-Stock

1+ parts

$26.249

100+ parts

$24.937

1k+ parts

$23.624

10k+ parts

-

811

$26.249

$24.937

$23.624

-

ChromeModa Solutions

Germany . 384 parts In-Stock

1+ parts

$26.249

100+ parts

$21.524

1k+ parts

-

10k+ parts

-

384

$26.249

$21.524

-

-

Overview

Unlock the potential of your electronic projects with the Texas Instruments MSP430F2254TRHAR microcontroller. Known for their superior quality and innovative technology, Texas Instruments has once again delivered a cutting-edge solution for your embedded system needs. This versatile device offers a wide range of applications in various industries, providing value and efficiency to your designs. With features like low power mode, analog to digital converters, and multiple connectivity options, the MSP430F2254TRHAR stands out as a reliable and high-performance choice for your next project. Experience the benefits of advanced technology and seamless integration with this powerful microcontroller from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for versatility in power supply options for different applications.

On Chip Data RAM Width: 8

Having a wide on-chip data RAM width allows for efficient data processing and storage within the microcontroller.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, ideal for applications where size is a concern.

Bit Size: 16

A 16-bit microcontroller provides higher processing power and precision compared to lower bit sizes.

Power Supplies (V): 2/3.3

Having multiple power supply options allows for flexibility in designing power management systems for the microcontroller.

No. of Terminals: 40

Having a sufficient number of terminals enables connections to various peripherals and external devices for expanded functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles provide options for different mounting and cooling requirements, catering to specific application needs.

Minimum Supply Voltage: 3.3 V

The low minimum supply voltage helps in reducing power consumption and extending battery life in portable devices.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range ensures reliable performance even in harsh environmental conditions.

CPU Family: MSP430

Being part of the MSP430 family indicates advanced features, energy efficiency, and robust performance of the microcontroller.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the microcontroller to function in extreme cold conditions, ensuring reliability in various environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish with nickel, palladium, and gold ensures good solderability and corrosion resistance for long-term reliability.

ADC Channels: YES

Having ADC channels allows the microcontroller to interface with analog sensors and signals, expanding its capabilities in data acquisition.

Terminal Position: QUAD

The quad terminal position simplifies PCB layout and provides a standard interface for easy connectivity in various applications.

ROM Words: 16640

The large ROM capacity of 16640 words allows for storing extensive program code and data in the microcontroller for complex applications.

Maximum Seated Height: 1 mm

The low maximum seated height contributes to a slim and compact design, suitable for space-constrained designs.

RAM Words: 0.5

Although small, having RAM words allows for temporary data storage and efficient data processing within the microcontroller.

Width: 6 mm

The compact width of 6 mm enables versatile integration of the microcontroller in various electronic designs and PCB layouts.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging of the microcontroller during production and maintenance phases.

Peripherals: BOD, COMPARATOR(8), TIMER(6), WDT

A wide range of peripherals such as brown-out detection, comparators, timers, and watch-dog timer enhances the functionality and utility of the microcontroller.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency of 16 MHz allows for fast and efficient processing of instructions, improving overall performance.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable solder joints and PCB assembly during manufacturing processes.

Length: 6 mm

The compact length of 6 mm complements the width, offering a space-saving solution for electronic designs with size constraints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates the robustness and reliability of the microcontroller for use in industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller allows for efficient and optimized performance in executing instructions and handling data processing tasks.

No. of Timers: 6

Having six timers provides versatility in timing functions and tasks within the microcontroller, enhancing its capability for time-sensitive applications.

RAM Bytes: 512

The ample RAM capacity of 512 bytes enables efficient data storage and processing during operation, supporting complex algorithms and data manipulation.

Technology: BIPOLAR

Utilizing bipolar technology ensures high-speed operation and precise control, making the microcontroller suitable for demanding applications requiring fast response times.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the soldering process and enhances reliability by reducing the risk of solder joint failure.

Analog To Digital Convertors: 12-Ch 10-Bit

Having twelve channels with 10-bit resolution ADCs enables accurate conversion of analog signals to digital data, essential for sensor interfacing and signal processing.

Maximum Supply Current: 0.55 mA

The low maximum supply current requirement of 0.55 mA contributes to energy efficiency and helps in extending battery life in portable devices.

Nominal Supply Voltage: 2.2 V

Having a low nominal supply voltage of 2.2 V supports energy-efficient operation and compatibility with low-power applications.

No. of Serial I/Os: 2

Two serial I/O interfaces provide connectivity options for communication with external devices, expanding the microcontroller's capability for data exchange.

PWM Channels: YES

Supporting PWM channels allows for precise control of analog output signals, making the microcontroller suitable for applications requiring accurate pulse-width modulation.

Connectivity: I2C, IRDA, LIN, SPI(2), UART, USCI(2)

The various connectivity options such as I2C, IRDA, LIN, SPI, UART, and USCI enable flexible communication interfaces for diverse application requirements.

ROM Programmability: FLASH

The flash ROM programmability offers flexibility in reprogramming and updating the microcontroller's firmware, essential for software modifications and upgrades.

Terminal Pitch: 0.5 mm

The compact terminal pitch of 0.5 mm allows for high-density mounting and space-efficient PCB layouts, beneficial for miniaturized electronic designs.

Format: FIXED POINT

Utilizing fixed-point format facilitates efficient numerical calculations and processing tasks, enhancing the microcontroller's performance in mathematical operations.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates the microcontroller's resistance to moisture-related degradation during storage and operation, ensuring long-term reliability.

Speed: 16 rpm

The operating speed of 16 rpm indicates the microcontroller's capability to execute instructions and process data efficiently, suitable for high-speed applications.

Low Power Mode: YES

The low power mode feature enables the microcontroller to operate in power-efficient states, conserving energy and prolonging battery life in portable applications.

On Chip Program ROM Width: 8

Having an on-chip program ROM width of 8 supports efficient program storage and execution within the microcontroller, enhancing its performance in running applications.

Technical Specifications

Microcontrollers MSP430F2254TRHAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of I/O Lines:

32

No. of Serial I/Os:

2

No. of Terminals:

40

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

0.5

ROM Words:

16640

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), TIMER(6), WDT"

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F2254TRHAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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