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MSP430F2254IYFFR

Texas Instruments

MSP430F2254IYFFR by Texas Instruments

MSP430F2254IYFFR by Texas Instruments is a 16-bit microcontroller with 32 I/O lines, 512 bytes of RAM, and 16384 ROM words. Operating at a max frequency of 16 MHz, it has PWM channels and ADC capabilities suitable for industrial applications requiring low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,334 parts In-Stock

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5,334

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Digiode

USA . 2,348 parts In-Stock

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2,348

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Distributors (Availability)

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AZTECH Wire

Italy . 604 parts In-Stock

1+ parts

$11.687

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$11.687

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One Stop Electronics

USA . 471 parts In-Stock

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$22.000

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471

$22.000

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Parana Technologies

USA . 2,095 parts In-Stock

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$62.674

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$62.674

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IDEA Electronic Components Group

UK . 1,345 parts In-Stock

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$70.420

100+ parts

$66.899

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$63.378

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1,345

$70.420

$66.899

$63.378

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ChromeModa Solutions

Germany . 1,327 parts In-Stock

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$70.420

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$57.744

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1,327

$70.420

$57.744

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Microchip USA

USA . 4,755 parts In-Stock

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4,755

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Corphita

USA . 2,211 parts In-Stock

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DigiPath Technology Company

USA . 987 parts In-Stock

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$63.491

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F2254IYFFR microcontroller. Built to the highest quality standards, this versatile device offers unmatched performance and reliability for a wide range of applications. Whether you're designing cutting-edge IoT devices or smart home solutions, this microcontroller provides the perfect balance of power efficiency and functionality. Experience seamless integration, enhanced productivity, and endless possibilities with the MSP430F2254IYFFR from Texas Instruments. Elevate your projects to new heights with this industry-leading solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring a longer lifespan and reliability.

Surface Mount: YES

Surface mountable microcontrollers are easy to integrate onto circuit boards, saving space and making the manufacturing process more efficient.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

Package Shape: SQUARE

Square package shape is compact and easy to work with, making it suitable for various applications where space is limited.

Bit Size: 16

A 16-bit microcontroller offers improved performance and processing capabilities compared to lower bit sizes, making it ideal for handling complex tasks.

Power Supplies (V): 2/3.3

The dual power supply options provide versatility in powering the microcontroller, allowing it to be used in different environments and configurations.

No. of Terminals: 49

Having 49 terminals enables the microcontroller to interface with a variety of external devices and components, expanding its connectivity options.

Minimum Supply Voltage: 3.3 V

The minimum supply voltage ensures optimal performance and stability of the microcontroller, protecting it from potential damage due to insufficient power.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85°C makes this microcontroller suitable for industrial applications where higher temperatures may be encountered.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high efficiency, making it an excellent choice for battery-powered applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this microcontroller can withstand cold environments or temperature fluctuations without performance degradation.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals into digital data, enabling precise and accurate measurements in various sensing applications.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, promoting ease of integration and reducing the risk of signal interference or short circuits.

ROM Words: 16384

With 16384 ROM words, this microcontroller has sufficient memory capacity to store program instructions and data, supporting complex algorithms and applications.

Maximum Seated Height: 0.625 mm

The low seated height of 0.625 mm allows for a compact design, enabling the microcontroller to be used in space-constrained applications or devices.

Maximum Clock Frequency: 16 MHz

Operating at a maximum clock frequency of 16 MHz, this microcontroller can process instructions quickly and efficiently, delivering high performance in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature of 260°C ensures proper soldering and reliability during manufacturing processes, reducing the risk of component damage.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades means this microcontroller can operate reliably in harsh environments with extreme temperature conditions, ensuring long-term performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Featuring RISC architecture, this microcontroller offers high processing efficiency and speed, making it suitable for embedded control applications that require fast execution of tasks.

RAM Bytes: 512

The 512 bytes of RAM provide temporary storage for data and variables during program execution, facilitating multitasking and efficient memory management.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and noise immunity, enhancing the overall performance and reliability of the microcontroller.

Terminal Form: BALL

Ball terminal form simplifies soldering during assembly and promotes better electrical connections, ensuring a stable and reliable connection between the microcontroller and the PCB.

Maximum Supply Current: 0.55 mA

Consuming only 0.55 mA of supply current, this microcontroller is energy-efficient and suitable for battery-powered devices or applications that require low power consumption.

PWM Channels: YES

Featuring PWM channels allows the microcontroller to generate precise analog output signals, making it ideal for applications such as motor control, LED dimming, and audio modulation.

ROM Programmability: FLASH

The flash programmability of ROM allows for easy and flexible reprogramming of the microcontroller, enabling updates and modifications to the firmware without the need for specialized programming equipment.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4 mm provides a fine-pitch configuration that saves space on the PCB and allows for high-density interconnections, making it suitable for compact designs.

Speed: 16 rpm

Operating at a speed of 16 rpm, this microcontroller can process tasks quickly and efficiently, ensuring responsive performance in time-sensitive applications.

No. of I/O Lines: 32

With 32 I/O lines, the microcontroller can interface with a variety of external devices and sensors, enabling versatile connectivity options for different application requirements.

Technical Specifications

Microcontrollers MSP430F2254IYFFR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B49

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

32

No. of Terminals:

49

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA49,7X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

.625 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

MSP430F2254IYFFR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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