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MSP430F2012IRSAR

Texas Instruments

MSP430F2012IRSAR by Texas Instruments

MSP430F2012IRSAR by Texas Instruments is a 16-bit microcontroller with 2048 ROM words and 128 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption. Features include 8-channel ADC, PWM channels, and connectivity options like I2C and SPI.

Median Price

$2.488

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 232,220 parts In-Stock

1+ parts

$2.007

100+ parts

$1.658

1k+ parts

$0.896

10k+ parts

-

232,220

$2.007

$1.658

$0.896

-

Mouser Electronics

USA . 2,655 parts In-Stock

1+ parts

$2.970

100+ parts

$1.760

1k+ parts

$1.440

10k+ parts

$1.380

2,655

$2.970

$1.760

$1.440

$1.380

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 638 parts In-Stock

1+ parts

$1.907

100+ parts

-

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-

10k+ parts

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638

$1.907

-

-

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Component Electronics Inc.

Canada . 2,218 parts In-Stock

1+ parts

$11.540

100+ parts

$8.650

1k+ parts

$7.500

10k+ parts

-

2,218

$11.540

$8.650

$7.500

-

Vyrian

USA . 7,097 parts In-Stock

1+ parts

-

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7,097

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-

-

-

Chip Stock

USA . 6,900 parts In-Stock

1+ parts

-

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6,900

-

-

-

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ComSIT Distribution GmbH

Germany . 210 parts In-Stock

1+ parts

-

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210

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ComSIT USA

USA . 210 parts In-Stock

1+ parts

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210

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Diverse Electronics

Canada . 204 parts In-Stock

1+ parts

-

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-

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204

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 233 parts In-Stock

1+ parts

$1.806

100+ parts

-

1k+ parts

-

10k+ parts

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233

$1.806

-

-

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Parana Technologies

USA . 1,692 parts In-Stock

1+ parts

$14.179

100+ parts

-

1k+ parts

$14.636

10k+ parts

-

1,692

$14.179

-

$14.636

-

DigiPath Technology Company

USA . 99 parts In-Stock

1+ parts

$15.612

100+ parts

$14.363

1k+ parts

-

10k+ parts

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99

$15.612

$14.363

-

-

ChromeModa Solutions

Germany . 3,184 parts In-Stock

1+ parts

$15.931

100+ parts

$13.063

1k+ parts

-

10k+ parts

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3,184

$15.931

$13.063

-

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IDEA Electronic Components Group

UK . 1,208 parts In-Stock

1+ parts

$15.931

100+ parts

$15.134

1k+ parts

$14.338

10k+ parts

-

1,208

$15.931

$15.134

$14.338

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Lixinc

USA . 19,989 parts In-Stock

1+ parts

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19,989

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A-Z Elektronik GmbH

Germany . 7,226 parts In-Stock

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7,226

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Kepictronics

USA . 5,060 parts In-Stock

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5,060

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iodParts Technologies Inc.

India . 100 parts In-Stock

1+ parts

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100

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-

Overview

Experience the cutting-edge technology of the MSP430F2012IRSAR microcontroller by Texas Instruments, a leading manufacturer known for their high-quality products. This versatile device is perfect for a variety of applications, offering exceptional performance and reliability. With features like low power mode, connectivity options, and analog to digital converters, this microcontroller provides immense value and benefits to customers seeking top-of-the-line technology. Trust in Texas Instruments for innovative solutions that will elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power input and compatibility with different voltage sources.

On Chip Data RAM Width: 8

8-bit data RAM width allows for efficient data processing and storage capabilities within the microcontroller.

Bit Size: 16

16-bit architecture provides a balance between performance and resource utilization for a wide range of applications.

Maximum Clock Frequency: 16 MHz

High clock frequency enables fast processing speeds and real-time responsiveness in the microcontroller.

ADC Channels: YES

Having analog-to-digital converter channels allows for interfacing with sensors and external analog devices, expanding the microcontroller's capabilities.

ROM Programmability: FLASH

Flash programmable ROM enables easy and convenient reprogramming of the microcontroller without requiring special equipment or processes.

Technical Specifications

Microcontrollers MSP430F2012IRSAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 1.8 V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

10

No. of Serial I/Os:

0

No. of Terminals:

16

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, TIMER(2), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430F2012IRSAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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