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MSP430F2003TPW

Texas Instruments

MSP430F2003TPW by Texas Instruments

MSP430F2003TPW by Texas Instruments is a 16-bit microcontroller with 1024 ROM words and 128 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption. With peripherals like BOD, TIMER(2), WDT and connectivity options such as I2C, SPI, USI, it offers versatile solutions in a compact package style.

Median Price

$2.386

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,160 parts In-Stock

1+ parts

$2.386

100+ parts

$2.090

1k+ parts

$1.181

10k+ parts

-

4,160

$2.386

$2.090

$1.181

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,261 parts In-Stock

1+ parts

$2.267

100+ parts

-

1k+ parts

-

10k+ parts

-

2,261

$2.267

-

-

-

Vyrian

USA . 4,116 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,116

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,628 parts In-Stock

1+ parts

$2.147

100+ parts

-

1k+ parts

-

10k+ parts

-

2,628

$2.147

-

-

-

Microchip USA

USA . 2,197 parts In-Stock

1+ parts

$14.340

100+ parts

$14.260

1k+ parts

$14.210

10k+ parts

$14.170

2,197

$14.340

$14.260

$14.210

$14.170

AZTECH Wire

Italy . 234 parts In-Stock

1+ parts

$17.770

100+ parts

-

1k+ parts

-

10k+ parts

-

234

$17.770

-

-

-

Parana Technologies

USA . 1,800 parts In-Stock

1+ parts

$24.903

100+ parts

-

1k+ parts

$25.596

10k+ parts

-

1,800

$24.903

-

$25.596

-

DigiPath Technology Company

USA . 479 parts In-Stock

1+ parts

$27.421

100+ parts

$25.228

1k+ parts

-

10k+ parts

-

479

$27.421

$25.228

-

-

ChromeModa Solutions

Germany . 3,327 parts In-Stock

1+ parts

$27.981

100+ parts

$22.944

1k+ parts

-

10k+ parts

-

3,327

$27.981

$22.944

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-

IDEA Electronic Components Group

UK . 621 parts In-Stock

1+ parts

$27.981

100+ parts

$26.582

1k+ parts

$25.183

10k+ parts

-

621

$27.981

$26.582

$25.183

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$28.275

100+ parts

$25.730

1k+ parts

$23.186

10k+ parts

-

2,000

$28.275

$25.730

$23.186

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Kepictronics

USA . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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800

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Overview

Unlock the potential of your next project with the Texas Instruments MSP430F2003TPW microcontroller. Designed with quality and precision by a trusted manufacturer, this versatile device offers a wide range of applications in various industries. With its low power consumption, high performance, and compact design, this microcontroller provides unmatched value and benefits to customers. From industrial automation to consumer electronics, the MSP430F2003TPW is the perfect solution for your needs. Experience innovation like never before with this advanced technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring reliable performance.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages, making it versatile for a variety of applications.

CPU Family: MSP430

Part of the MSP430 family known for low power consumption and efficient performance.

ADC Channels: YES

Ability to convert analog signals to digital data for more accurate measurements and control.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the microcontroller, enhancing flexibility.

Connectivity: I2C, SPI, USI

Multiple communication interfaces provide compatibility with various devices and systems.

Analog To Digital Convertors: 1-Ch 16-Bit

High-resolution ADC enables precise analog signal conversion for superior performance.

Low Power Mode: YES

Efficient low power mode helps conserve energy and extend battery life, ideal for portable devices.

Technical Specifications

Microcontrollers MSP430F2003TPW attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 1.8 V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of I/O Lines:

10

No. of Serial I/Os:

0

No. of Terminals:

14

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

1024

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, TIMER(2), WDT"

Analog To Digital Convertors:

1-Ch 16-Bit

Trade Compliance

MSP430F2003TPW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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