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MSP430F156IRTDT

Texas Instruments

MSP430F156IRTDT by Texas Instruments

MSP430F156IRTDT by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 24576 ROM words. It features 8-ch ADC, 2-ch DAC, and 6 timers suitable for industrial applications requiring low power consumption. With I2C, SPI, UART connectivity options and peak clock frequency of 8 MHz, it offers versatile performance in a compact chip carrier package.

Median Price

$12.621

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,750 parts In-Stock

1+ parts

$12.621

100+ parts

$11.024

1k+ parts

$7.603

10k+ parts

-

5,750

$12.621

$11.024

$7.603

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 70 parts In-Stock

1+ parts

$11.990

100+ parts

-

1k+ parts

-

10k+ parts

-

70

$11.990

-

-

-

Vyrian

USA . 6,718 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,718

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 877 parts In-Stock

1+ parts

$11.359

100+ parts

-

1k+ parts

-

10k+ parts

-

877

$11.359

-

-

-

Parana Technologies

USA . 967 parts In-Stock

1+ parts

$14.340

100+ parts

-

1k+ parts

$14.790

10k+ parts

-

967

$14.340

-

$14.790

-

DigiPath Technology Company

USA . 2,059 parts In-Stock

1+ parts

$15.790

100+ parts

-

1k+ parts

-

10k+ parts

-

2,059

$15.790

-

-

-

ChromeModa Solutions

Germany . 6,783 parts In-Stock

1+ parts

$16.112

100+ parts

$13.212

1k+ parts

-

10k+ parts

-

6,783

$16.112

$13.212

-

-

IDEA Electronic Components Group

UK . 423 parts In-Stock

1+ parts

$16.112

100+ parts

$15.306

1k+ parts

$14.501

10k+ parts

-

423

$16.112

$15.306

$14.501

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AZTECH Wire

Italy . 1,134 parts In-Stock

1+ parts

$18.330

100+ parts

-

1k+ parts

-

10k+ parts

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1,134

$18.330

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Component Stockers USA

USA . 6,337 parts In-Stock

1+ parts

-

100+ parts

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6,337

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Overview

Unlock the power of innovative technology with the MSP430F156IRTDT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that are perfect for a wide range of applications. From industrial automation to consumer electronics, this versatile product offers unmatched value and benefits to customers. Experience seamless connectivity, low power consumption, and high performance with the MSP430F156IRTDT, making it the ideal choice for your next project. Elevate your designs with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, ensuring compatibility with different systems.

Bit Size: 16

Provides a good balance between performance and power efficiency for a variety of tasks.

DAC Channels: YES

Enables the microcontroller to convert digital signals into analog outputs, expanding its range of functionalities.

No. of Terminals: 64

Offers a sufficient number of connection points for interfacing with external components and peripherals.

Maximum Operating Temperature: 85 °C

Ensures reliable operation in a wide range of environments, making it suitable for industrial applications.

ADC Channels: YES

Allows the microcontroller to convert external analog signals into digital data, increasing its versatility.

DMA Channels: YES

Supports Direct Memory Access channels for efficient data transfer, enhancing overall system performance.

ROM Words: 24576

Provides a generous amount of Read-Only Memory for storing program instructions and data.

Maximum Clock Frequency: 8 MHz

Offers a high clock speed for fast processing, ideal for real-time applications and high-speed communication.

Peripheral IC Type: MICROCONTROLLER, RISC

Based on Reduced Instruction Set Computing architecture, which enhances performance efficiency and power consumption.

Technical Specifications

Microcontrollers MSP430F156IRTDT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

24576

ROM Programmability:

FLASH

Maximum Seated Height:

.9 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, UART, USART"

Peripherals:

"COMPARATOR, DMA(3), TIMER(6), WDT"

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F156IRTDT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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