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MSP430F1471IPMR

Texas Instruments

MSP430F1471IPMR by Texas Instruments

MSP430F1471IPMR by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 32768 ROM words. It operates at a max clock frequency of 8 MHz, suitable for industrial applications requiring low power consumption. Features include ADC channels, PWM capabilities, and connectivity options like SPI and UART.

Median Price

$13.620

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,452 parts In-Stock

1+ parts

$9.914

100+ parts

$8.082

1k+ parts

$5.388

10k+ parts

-

6,452

$9.914

$8.082

$5.388

-

DigiKey

USA . 1,019 parts In-Stock

1+ parts

$13.620

100+ parts

$9.222

1k+ parts

$8.429

10k+ parts

-

1,019

$13.620

$9.222

$8.429

-

Mouser Electronics

USA . 488 parts In-Stock

1+ parts

$13.620

100+ parts

$9.220

1k+ parts

$8.420

10k+ parts

-

488

$13.620

$9.220

$8.420

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,837 parts In-Stock

1+ parts

$9.418

100+ parts

-

1k+ parts

-

10k+ parts

-

1,837

$9.418

-

-

-

Vyrian

USA . 3,763 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,763

-

-

-

-

LIBRA Elektronik GmbH

Germany . 363 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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363

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,657 parts In-Stock

1+ parts

$8.923

100+ parts

-

1k+ parts

-

10k+ parts

-

1,657

$8.923

-

-

-

Parana Technologies

USA . 1,347 parts In-Stock

1+ parts

$37.931

100+ parts

-

1k+ parts

-

10k+ parts

-

1,347

$37.931

-

-

-

DigiPath Technology Company

USA . 2,002 parts In-Stock

1+ parts

$41.767

100+ parts

$38.425

1k+ parts

-

10k+ parts

-

2,002

$41.767

$38.425

-

-

ChromeModa Solutions

Germany . 2,172 parts In-Stock

1+ parts

$42.619

100+ parts

$34.948

1k+ parts

-

10k+ parts

-

2,172

$42.619

$34.948

-

-

IDEA Electronic Components Group

UK . 678 parts In-Stock

1+ parts

$42.619

100+ parts

$40.488

1k+ parts

$38.357

10k+ parts

-

678

$42.619

$40.488

$38.357

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Perfect Parts

USA . 3,360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,360

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Kepictronics

USA . 407 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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407

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F1471IPMR microcontroller. Designed with quality and precision by a trusted manufacturer, this versatile device offers endless possibilities in various applications. From low power mode to its wide range of peripherals, this product provides exceptional value and benefits to customers looking for reliable and efficient performance. Experience the advantages of cutting-edge technology and take your projects to the next level with the MSP430F1471IPMR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy installation and saves space on the PCB, making the product more compact.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in the power supply, enabling the microcontroller to work efficiently in different environments.

On Chip Data RAM Width: 8

The wide data RAM width enhances the processing speed and performance of the microcontroller.

Package Shape: SQUARE

The square shape of the package allows for easy integration into various designs and layouts.

Bit Size: 16

The 16-bit architecture provides enhanced processing capabilities for the microcontroller, enabling it to handle complex tasks effectively.

Power Supplies (V): 2/3.3

The availability of multiple power supply options enhances the compatibility of the microcontroller with different power sources.

No. of Terminals: 64

The ample number of terminals allows for versatile connectivity options, enabling the microcontroller to communicate with other devices effectively.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile design with fine pitch terminals makes the microcontroller suitable for space-constrained applications.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage ensures the microcontroller can operate efficiently even in low-power scenarios.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes the microcontroller suitable for industrial applications where temperature fluctuations are common.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it a reliable choice for energy-efficient applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the microcontroller to function reliably in extreme cold environments.

Technical Specifications

Microcontrollers MSP430F1471IPMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"SPI, UART, USART(2)"

Peripherals:

"COMPARATOR, POR, PWM, TIMER(2), WDT"

Trade Compliance

MSP430F1471IPMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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