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MSP430F1122IRHBR

Texas Instruments

MSP430F1122IRHBR by Texas Instruments

MSP430F1122IRHBR by Texas Instruments is a 16-bit microcontroller with 256 bytes of RAM and 4096 ROM words. Operating at a max clock frequency of 8 MHz, it has 14 I/O lines and PWM channels for various industrial applications. With a supply voltage range of 1.8V to 3.6V, this CMOS technology-based microcontroller is suitable for use in temperature-sensitive environments with an operating range from -40°C to +85°C.

Median Price

$1.682

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$1.590

1k+ parts

$1.420

10k+ parts

$1.340

9,000

-

$1.590

$1.420

$1.340

Verical

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.775

10k+ parts

$1.675

9,000

-

-

$1.775

$1.675

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,463 parts In-Stock

1+ parts

$1.682

100+ parts

-

1k+ parts

-

10k+ parts

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3,463

$1.682

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-

-

DigiKey Marketplace

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$1.840

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-

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9,000

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$1.840

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Vyrian

USA . 5,362 parts In-Stock

1+ parts

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5,362

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,938 parts In-Stock

1+ parts

$1.593

100+ parts

-

1k+ parts

-

10k+ parts

-

4,938

$1.593

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-

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Andel Nordic

Denmark . 2,646 parts In-Stock

1+ parts

$3.955

100+ parts

-

1k+ parts

$3.797

10k+ parts

$3.797

2,646

$3.955

-

$3.797

$3.797

Parana Technologies

USA . 623 parts In-Stock

1+ parts

$56.076

100+ parts

-

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10k+ parts

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623

$56.076

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DigiPath Technology Company

USA . 1,086 parts In-Stock

1+ parts

$61.747

100+ parts

$56.807

1k+ parts

-

10k+ parts

-

1,086

$61.747

$56.807

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ChromeModa Solutions

Germany . 3,130 parts In-Stock

1+ parts

$63.007

100+ parts

$51.666

1k+ parts

-

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3,130

$63.007

$51.666

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IDEA Electronic Components Group

UK . 2,158 parts In-Stock

1+ parts

$63.007

100+ parts

$59.857

1k+ parts

$56.706

10k+ parts

-

2,158

$63.007

$59.857

$56.706

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Microchip USA

USA . 3,953 parts In-Stock

1+ parts

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3,953

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Overview

Unlock the power of innovation with the MSP430F1122IRHBR by Texas Instruments, a top-of-the-line microcontroller designed to meet your unique needs. With a reputation for excellence, Texas Instruments delivers cutting-edge technology that guarantees reliability and performance. Ideal for a wide range of applications, this microcontroller offers seamless integration and unmatched efficiency. Experience the value of precision engineering and unleash the potential of your projects with the MSP430F1122IRHBR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power requirements, accommodating a wider range of applications.

Bit Size: 16

With a larger bit size, this microcontroller can handle more complex operations and computations, making it suitable for advanced tasks.

No. of Terminals: 32

Having a higher number of terminals allows for more connectivity options with external components, enabling greater versatility in system design.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes this microcontroller suitable for use in harsh environmental conditions or industrial settings.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, making it ideal for applications involving sensor interfacing or data acquisition.

RAM Bytes: 256

Having a larger RAM size allows for efficient data storage and manipulation, enabling the microcontroller to handle complex algorithms and tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy efficient and reliable in noisy environments.

PWM Channels: YES

Pulse-width modulation (PWM) channels allow for precise control of analog devices, making this microcontroller suitable for applications requiring accurate motor or LED control.

Technical Specifications

Microcontrollers MSP430F1122IRHBR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY @ 3MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

14

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

MSP430F1122IRHBR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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