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MSP430AFE252IPW

Texas Instruments

MSP430AFE252IPW by Texas Instruments

MSP430AFE252IPW by Texas Instruments is a 16-bit microcontroller with 24 terminals, operating at up to 12 MHz. It features 2-Ch 24-Bit ADCs, BOR, POR, and low power mode. Ideal for industrial applications requiring high-speed processing and connectivity via SPI, UART, and USART interfaces.

Median Price

$7.678

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,285 parts In-Stock

1+ parts

$5.246

100+ parts

$4.277

1k+ parts

$2.851

10k+ parts

-

6,285

$5.246

$4.277

$2.851

-

Mouser Electronics

USA . 48 parts In-Stock

1+ parts

$10.110

100+ parts

$7.450

1k+ parts

$5.300

10k+ parts

$5.080

48

$10.110

$7.450

$5.300

$5.080

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,782 parts In-Stock

1+ parts

$4.984

100+ parts

-

1k+ parts

-

10k+ parts

-

4,782

$4.984

-

-

-

Vyrian

USA . 4,625 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,625

-

-

-

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Semtec, LLC

USA . 152 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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152

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,242 parts In-Stock

1+ parts

$4.721

100+ parts

-

1k+ parts

-

10k+ parts

-

2,242

$4.721

-

-

-

Parana Technologies

USA . 1,522 parts In-Stock

1+ parts

$27.453

100+ parts

-

1k+ parts

$36.067

10k+ parts

-

1,522

$27.453

-

$36.067

-

ChromeModa Solutions

Germany . 6,158 parts In-Stock

1+ parts

$30.846

100+ parts

$25.294

1k+ parts

-

10k+ parts

-

6,158

$30.846

$25.294

-

-

IDEA Electronic Components Group

UK . 1,373 parts In-Stock

1+ parts

$30.846

100+ parts

$29.304

1k+ parts

$27.761

10k+ parts

-

1,373

$30.846

$29.304

$27.761

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QUARKTWIN TECHNOLOGY LTD

USA . 9,105 parts In-Stock

1+ parts

-

100+ parts

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9,105

-

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DigiPath Technology Company

USA . 2,169 parts In-Stock

1+ parts

-

100+ parts

$27.811

1k+ parts

-

10k+ parts

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2,169

-

$27.811

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Perfect Parts

USA . 110 parts In-Stock

1+ parts

-

100+ parts

-

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110

-

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Overview

Unlock the power of innovation with the Texas Instruments MSP430AFE252IPW microcontroller. Designed with cutting-edge technology and superior quality, this device offers unparalleled performance in a compact and efficient package. Ideal for a wide range of applications, from consumer electronics to industrial automation, this microcontroller delivers high-speed processing and low power consumption. Experience seamless connectivity with SPI, UART, and USART interfaces while benefiting from advanced features like PWM channels and analog-to-digital converters. Trust Texas Instruments to provide you with the tools you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost during production.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V provides flexibility in power supply options for various applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient space utilization on the PCB, maximizing component density.

Bit Size: 16

16-bit architecture enables efficient processing of data and instructions, suitable for a wide range of embedded applications.

No. of Terminals: 24

With 24 terminals, this microcontroller offers ample I/O options for interfacing with external components and peripherals.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and is suitable for compact designs where size is a constraint.

Minimum Supply Voltage: 1.8 V

Support for a minimum supply voltage of 1.8V allows for operation in low-power scenarios, extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliable performance in harsh environmental conditions.

CPU Family: MSP430

MSP430 CPU family is known for its low-power consumption and high performance, making it suitable for battery-operated devices.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C enables operation in extreme cold environments without impacting performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

ADC Channels: YES

Built-in ADC channels enable the microcontroller to interface with analog sensors and signals, expanding the range of potential applications.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout design and provides redundant connections for increased reliability.

ROM Words: 16384

Large ROM size of 16384 words allows for storing a significant amount of program code and data, suitable for complex applications.

Maximum Seated Height: 1.2 mm

Low maximum seated height of 1.2mm reduces the overall profile of the device, making it suitable for slim and compact designs.

Width: 4.4 mm

Narrow width of 4.4mm saves space on the PCB and allows for high component density in tight layouts.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging of the device during manufacturing, ensuring quality and reliability.

Peripherals: BOR, POR, TIMER(3), WDT

Presence of built-in peripherals such as brownout reset, power-on reset, timers, and watchdog timer enhances functionality and performance.

Maximum Clock Frequency: 12 MHz

High maximum clock frequency of 12MHz allows for fast processing and precise timing in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The microcontroller can withstand peak reflow temperatures for up to 30 seconds, ensuring proper soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance of 260°C enables reliable soldering processes without damaging the device.

Length: 7.8 mm

Compact length of 7.8mm saves space on the PCB and allows for efficient component placement in constrained designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environments and demanding industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller architecture offers high performance and efficiency, suitable for a wide range of embedded applications.

RAM Bytes: 512

512 bytes of RAM provide sufficient memory for data storage and manipulation, supporting multi-tasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form enables easy surface mount soldering and reliable electrical connections, ensuring robust performance.

Analog To Digital Convertors: 2-Ch 24-Bit

Two-channel 24-bit ADCs allow for accurate and precise conversion of analog signals to digital data, essential for sensor interfacing.

Maximum Supply Current: 4.5 mA

Low maximum supply current of 4.5mA reduces power consumption and extends battery life in energy-efficient applications.

Nominal Supply Voltage: 2.2 V

Stable nominal supply voltage of 2.2V ensures consistent and reliable operation of the microcontroller across various load conditions.

PWM Channels: YES

Support for PWM channels allows for precise control of analog functions and efficient power management in motor control and lighting applications.

Connectivity: SPI, UART, USART

Multiple connectivity options including SPI, UART, and USART enable seamless communication with external devices and peripherals, enhancing versatility.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in updating firmware and software, enabling easy maintenance and future-proofing of the device.

Terminal Pitch: 0.65 mm

Narrow terminal pitch of 0.65mm allows for high-density mounting on the PCB, saving space and enabling compact designs.

Speed: 12 rpm

High processing speed of 12rpm ensures responsive performance in time-critical applications, enhancing overall system efficiency.

Low Power Mode: YES

Built-in low-power modes enable the microcontroller to conserve energy during idle periods, prolonging battery life in portable devices.

On Chip Program ROM Width: 8

8-bit on-chip program ROM width allows for efficient storage and retrieval of instructions, enhancing processing efficiency.

No. of I/O Lines: 11

With 11 I/O lines, the microcontroller offers versatile interfacing options for connecting to external sensors, actuators, and communication peripherals.

Technical Specifications

Microcontrollers MSP430AFE252IPW attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

11

No. of Terminals:

24

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

12 rpm

Maximum Supply Current:

4.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI, UART, USART

Peripherals:

BOR, POR, TIMER(3), WDT

Analog To Digital Convertors:

2-Ch 24-Bit

Trade Compliance

MSP430AFE252IPW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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