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MSP430A138IPNR

Texas Instruments

MSP430A138IPNR by Texas Instruments

MSP430A138IPNR by Texas Instruments is a 16-bit microcontroller with 2-Ch 12-Bit DAC channels, operating at max 8 MHz. Ideal for industrial applications, it features BOR, LCD, RTC peripherals and supports I2C, LIN connectivity. With low power mode and flash ROM programmability, it offers high performance in a compact package.

Median Price

$8.137

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 12,000 parts In-Stock

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-

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$8.137

10k+ parts

$7.034

12,000

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-

$8.137

$7.034

Distributors (In-Stock)

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Vyrian

USA . 5,966 parts In-Stock

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5,966

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Digiode

USA . 1,359 parts In-Stock

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1,359

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Distributors (Availability)

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AZTECH Wire

Italy . 836 parts In-Stock

1+ parts

$14.978

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836

$14.978

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One Stop Electronics

USA . 1,477 parts In-Stock

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$19.000

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1,477

$19.000

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Microchip USA

USA . 1,108 parts In-Stock

1+ parts

$27.080

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$26.690

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$26.500

10k+ parts

$26.310

1,108

$27.080

$26.690

$26.500

$26.310

Parana Technologies

USA . 2,189 parts In-Stock

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$73.442

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2,189

$73.442

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DigiPath Technology Company

USA . 1,184 parts In-Stock

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$80.869

100+ parts

$74.399

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1,184

$80.869

$74.399

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ChromeModa Solutions

Germany . 4,762 parts In-Stock

1+ parts

$82.519

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$67.666

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4,762

$82.519

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IDEA Electronic Components Group

UK . 677 parts In-Stock

1+ parts

$82.519

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$78.393

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$74.267

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677

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$74.267

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Corphita

USA . 4,147 parts In-Stock

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Overview

Unlock the endless possibilities of innovation with the Texas Instruments MSP430A138IPNR Microcontroller. Crafted with precision and expertise, this device offers unparalleled performance and reliability for a wide range of applications. From IoT devices to consumer electronics, this product delivers exceptional value, efficiency, and versatility. Trust in Texas Instruments to provide you with cutting-edge technology that empowers your projects to reach new heights. Join the ranks of satisfied customers who have experienced the advantages of the MSP430A138IPNR and see your ideas come to life like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 3.6 V

Ability to handle up to 3.6V ensures compatibility with a variety of power sources and applications.

Bit Size: 16

16-bit architecture allows for higher precision and performance in processing data and calculations.

DAC Channels: YES

Multiple DAC channels enable the microcontroller to convert digital signals into analog outputs, expanding its capabilities.

CPU Family: MSP430

Being part of the MSP430 CPU family ensures reliability and efficiency in operation.

ROM Words: 323584

Large ROM capacity allows for storing a significant amount of program instructions and data.

No. of Timers: 7

Having 7 timers provides flexibility in managing timing functions and tasks simultaneously.

Connectivity: I2C, IRDA, LIN, SCI(2), SPI(2), UART

Multiple connectivity options allow for easy integration with various devices and communication protocols.

Low Power Mode: YES

Low power mode helps in conserving energy and extending the battery life of the device.

Technical Specifications

Microcontrollers MSP430A138IPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

IT ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

1

No. of Terminals:

80

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

323584

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Current:

.46 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, LIN, SCI(2), SPI(2), UART

Peripherals:

BOR, COMPARATOR, LCD, RTC, TIMER(7), WDT

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430A138IPNR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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