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MSP430A009IPMR

Texas Instruments

MSP430A009IPMR by Texas Instruments

MSP430A009IPMR by Texas Instruments is a 16-bit microcontroller with 2/3.3V power supplies, 8MHz clock frequency, and 48 I/O lines. Ideal for industrial applications requiring low power consumption, it features 8-Ch 12-Bit ADC channels and peripherals like comparator, POR, timers(2), WDT.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,635 parts In-Stock

1+ parts

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5,635

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Digiode

USA . 2,840 parts In-Stock

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2,840

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 664 parts In-Stock

1+ parts

$12.433

100+ parts

-

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664

$12.433

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One Stop Electronics

USA . 1,377 parts In-Stock

1+ parts

$21.000

100+ parts

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1,377

$21.000

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Parana Technologies

USA . 1,635 parts In-Stock

1+ parts

$22.788

100+ parts

$2,116.253

1k+ parts

$20.510

10k+ parts

-

1,635

$22.788

$2,116.253

$20.510

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DigiPath Technology Company

USA . 1,216 parts In-Stock

1+ parts

$25.093

100+ parts

$23.085

1k+ parts

-

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1,216

$25.093

$23.085

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ChromeModa Solutions

Germany . 5,517 parts In-Stock

1+ parts

$25.605

100+ parts

$20.996

1k+ parts

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5,517

$25.605

$20.996

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IDEA Electronic Components Group

UK . 902 parts In-Stock

1+ parts

$25.605

100+ parts

$24.325

1k+ parts

$23.044

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902

$25.605

$24.325

$23.044

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Corphita

USA . 713 parts In-Stock

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713

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Perfect Parts

USA . 672 parts In-Stock

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672

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Overview

The MSP430A009IPMR by Texas Instruments is a game-changer in the world of microcontrollers, offering unparalleled quality and reliability. With a wide range of applications in various industries, this product provides exceptional value to customers seeking cutting-edge technology. From its low power mode to its impressive connectivity options, the MSP430A009IPMR delivers unmatched performance and efficiency. Trust Texas Instruments to bring you the best in microcontroller technology.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to physical damage, making the product reliable for long-term use.

Surface Mount YES

Surface mount design enables easy integration onto circuit boards, saving space and enhancing overall product compactness.

Maximum Supply Voltage 3.6 V

Allows for a wide range of voltage inputs, providing flexibility in voltage requirements for various applications.

On Chip Data RAM Width 8

The 8-bit data RAM width allows for efficient data processing and storage, enhancing the performance of the microcontroller.

Package Shape SQUARE

Square package shape facilitates easier handling and mounting of the microcontroller onto circuit boards, ensuring secure connections.

Bit Size 16

With a 16-bit architecture, the microcontroller offers enhanced processing capability and efficiency in handling complex algorithms and tasks.

Power Supplies (V) 2/3.3

Support for multiple power supply voltages allows for compatibility with various power sources, increasing the versatility of the product.

No. of Terminals 64

The high number of terminals provides ample connectivity options, allowing the microcontroller to interface with multiple external devices and sensors.

Minimum Supply Voltage 2.7 V

Ability to operate at low supply voltages ensures energy efficiency and extends battery life in portable electronic devices.

Maximum Operating Temperature 85 °C

Wide operating temperature range makes the microcontroller suitable for industrial applications, where temperature fluctuations are common.

CPU Family MSP430

The MSP430 CPU family is known for its low power consumption, making it ideal for battery-powered applications and devices.

Minimum Operating Temperature -40 °C

Capable of operating in harsh environments with extreme cold temperatures, ensuring reliability in various climatic conditions.

ADC Channels YES

Built-in Analog to Digital Converters enable the microcontroller to interface with analog sensors, expanding its sensing and data acquisition capabilities.

Terminal Finish NICKEL PALLADIUM GOLD

Nickel, Palladium, Gold finish provides corrosion resistance and ensures reliable electrical connections for long-term performance.

ADC Channels YES

Built-in Analog to Digital Converters enable the microcontroller to interface with analog sensors, expanding its sensing and data acquisition capabilities.

Maximum Seated Height 1.6 mm

Low profile design reduces the overall height of the component, making it suitable for compact electronic devices and applications.

RAM Words 2

Although small in size, the on-chip RAM provides essential memory for storing temporary data during processing, enhancing overall system performance.

Width 10 mm

Compact width dimensions make the microcontroller suitable for space-constrained designs, allowing for integration into small form factor devices.

Boundary Scan YES

Boundary Scan capability facilitates testing and debugging of the microcontroller during production, ensuring high-quality and reliable performance.

Peripheral IC Type MICROCONTROLLER, RISC

RISC architecture in a microcontroller design allows for efficient instruction execution, improving overall system performance and responsiveness.

PWM Channels YES

Pulse Width Modulation channels enable precise control of output signals, making the microcontroller suitable for applications requiring motor control or LED dimming.

Technical Specifications

Microcontrollers MSP430A009IPMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2

ROM Words:

49152

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"SPI, UART, USART(2)"

Peripherals:

"COMPARATOR, POR, TIMER(2), WDT"

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430A009IPMR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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