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MF100CCWM

Texas Instruments

MF100CCWM by Texas Instruments

The Texas Instruments MF100CCWM is a CMOS active filter with 2 functions, -5V to +5V supply voltage, and 12mA max supply current. Ideal for applications requiring switched capacitor filters, it operates b/w 0°C to 70°C with a peak reflow temp of 220°C. The small outline package features Gull Wing terminals and is surface mountable.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,086 parts In-Stock

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Digiode

USA . 1,610 parts In-Stock

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1,610

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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One Stop Electronics

USA . 372 parts In-Stock

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$1.690

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372

$1.690

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Ampacity Inc.

Singapore . 1,297 parts In-Stock

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$3.690

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$3.690

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Parana Technologies

USA . 1,625 parts In-Stock

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$6.901

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$7.508

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$6.901

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$7.508

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DigiPath Technology Company

USA . 2,108 parts In-Stock

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$7.599

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2,108

$7.599

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ChromeModa Solutions

Germany . 3,718 parts In-Stock

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$7.754

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$6.358

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$7.754

$6.358

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IDEA Electronic Components Group

UK . 1,020 parts In-Stock

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$7.754

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$6.979

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$6.979

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AZTECH Wire

Italy . 516 parts In-Stock

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$15.343

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Corphita

USA . 1,539 parts In-Stock

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Microchip USA

USA . 197 parts In-Stock

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Bastille Electronics

Australia . 34 parts In-Stock

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Overview

Upgrade your electronic projects with the high-quality MF100CCWM active filter by Texas Instruments. This versatile component offers a wide range of applications, from audio processing to signal conditioning, thanks to its advanced CMOS technology and switched capacitor filter design. With a low supply current of 12 mA and dual functions, this product delivers superior performance while maximizing efficiency. Enhance your designs today with the reliable and innovative solutions provided by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and reliability for long-term use.

Maximum Supply Current (Isup): 12 mA

Low supply current consumption makes it energy-efficient.

Surface Mount: YES

Surface mount option enables easy and convenient installation on PCBs.

No. of Functions: 2

Multiple functions in one device offer cost and space efficiency.

Technology: CMOS

CMOS technology provides high performance and low power consumption.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into electronic systems.

Nominal Negative Supply Voltage (Vsup): -5 V

Negative supply voltage support enhances the versatility of the product.

Active Filter Type: SWITCHED CAPACITOR FILTER

Switched capacitor filter design offers precise and efficient filtering capabilities.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage ensures consistent performance of the filter.

Power Supplies (V): +-5

Support for dual power supplies meets various application requirements.

No. of Terminals: 20

Sufficient number of terminals for connectivity and flexibility in circuit connections.

Package Style (Meter): SMALL OUTLINE

Compact small outline package saves space and facilitates PCB layout.

Maximum Operating Temperature: 70 °C

High operating temperature range ensures stability in different environmental conditions.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy integration with other components.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for operation in various temperature conditions.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability for secure connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB mounting orientations.

Moisture Sensitivity Level (MSL): 2A

Moisture sensitivity level 2A ensures reliability during storage and handling.

Maximum Time At Peak Reflow Temperature (s): 20

Short reflow time requirement for efficient manufacturing processes.

Peak Reflow Temperature °C: 220

High peak reflow temperature capability for reliable soldering.

Response Type: UNIVERSAL

Universal response type for versatile filtering applications.

Transfer Characteristics: BUTTERWORTH/BESSEL/ELLIPTIC/CHEBYSHEV

Multiple transfer characteristic options for customized filtering needs.

Temperature Grade: COMMERCIAL

Commercial temperature grade suitable for standard operating environments.

Technical Specifications

Active Filters MF100CCWM attributes and parameters. Explore more Active Filters devices from Texas Instruments

Electrical Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Current (Isup):

12 mA

Nominal Negative Supply Voltage:

-5 V

Power Supply:

±5 V

Performance Parameters

Semiconductor Technology:

CMOS

Response Type:

Filter Technology:

Transfer Characteristics:

Butterworth/Bessel/Elliptical/Chebyshev

Filter Order:

2nd

Environmental Characteristics

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Moisture Sensitivity Level (MSL):

2A

Soldering Temperature:

220 °C (428 °F)

Temperature Grade:

Reflow Temperature Time Limit:

20 s

Connectivity

Total Functions:

2

Total Terminals:

20

Terminal Finish:

Tin Lead

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Physical Characteristics

Package Style:

Small Outline

Form Factor:

Rectangular

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Body Material:

Plastic/Epoxy

Surface Mounting:

Yes

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Additional Features

Qualified:

No

Trade Compliance

MF100CCWM Active Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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