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MF100CCM

Texas Instruments

MF100CCM by Texas Instruments

The Texas Instruments MF100CCM is a CMOS active filter with 2 functions, operating at -5V to +5V. It features a switched capacitor design, GULL WING terminals, and can handle temperatures from 0°C to 70°C. Ideal for applications requiring universal response types like Butterworth or Chebyshev filters in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,298 parts In-Stock

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Digiode

USA . 4,579 parts In-Stock

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4,579

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Nova Conductors

Japan . 75 parts In-Stock

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75

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One Stop Electronics

USA . 179 parts In-Stock

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$5.690

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179

$5.690

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Ampacity Inc.

Singapore . 1,355 parts In-Stock

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$7.690

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$7.690

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Parana Technologies

USA . 422 parts In-Stock

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$13.616

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$14.114

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422

$13.616

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$14.114

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DigiPath Technology Company

USA . 1,821 parts In-Stock

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$14.993

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$13.794

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1,821

$14.993

$13.794

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ChromeModa Solutions

Germany . 6,182 parts In-Stock

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$15.299

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$12.545

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$15.299

$12.545

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IDEA Electronic Components Group

UK . 1,623 parts In-Stock

1+ parts

$15.299

100+ parts

$14.534

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$13.769

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1,623

$15.299

$14.534

$13.769

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AZTECH Wire

Italy . 602 parts In-Stock

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$17.149

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602

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Corphita

USA . 2,231 parts In-Stock

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Microchip USA

USA . 199 parts In-Stock

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199

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Bastille Electronics

Australia . 99 parts In-Stock

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Overview

Elevate your electronic designs with the MF100CCM by Texas Instruments, a top-quality active filter that offers unparalleled performance and reliability. Built by one of the industry's most trusted manufacturers, this switched capacitor filter is perfect for a wide range of applications, from audio processing to signal conditioning. With its efficient CMOS technology and universal response type, this product delivers exceptional value and benefits to customers seeking precision and versatility in their projects. Trust Texas Instruments to provide you with the tools you need to succeed in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Maximum Supply Current (Isup): 12 mA

With a relatively low supply current, this product helps in conserving energy and reducing power consumption.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on PCBs.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient performance.

Nominal Negative Supply Voltage (Vsup): -5 V

The negative supply voltage allows for bi-polar operation, expanding the range of applications for this active filter.

Active Filter Type: SWITCHED CAPACITOR FILTER

Switched capacitor filters offer precise frequency response and low component count, making them ideal for various signal processing tasks.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Transfer Characteristics: BUTTERWORTH/BESSEL/ELLIPTIC/CHEBYSHEV

The available transfer characteristics provide flexibility in achieving desired filtering outcomes for different applications.

Technical Specifications

Active Filters MF100CCM attributes and parameters. Explore more Active Filters devices from Texas Instruments

Electrical Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Current (Isup):

12 mA

Nominal Negative Supply Voltage:

-5 V

Power Supply:

±5 V

Performance Parameters

Semiconductor Technology:

CMOS

Response Type:

Filter Technology:

Transfer Characteristics:

Butterworth/Bessel/Elliptical/Chebyshev

Filter Order:

2nd

Environmental Characteristics

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Moisture Sensitivity Level (MSL):

2A

Soldering Temperature:

220 °C (428 °F)

Temperature Grade:

Reflow Temperature Time Limit:

20 s

Connectivity

Total Functions:

2

Total Terminals:

20

Terminal Finish:

Tin Lead

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Physical Characteristics

Package Style:

Small Outline

Form Factor:

Rectangular

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Body Material:

Plastic/Epoxy

Surface Mounting:

Yes

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Additional Features

Qualified:

No

Trade Compliance

MF100CCM Active Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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