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MAX3318EIDBG4

Texas Instruments

MAX3318EIDBG4 by Texas Instruments

MAX3318EIDBG4 by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at -40 to 85°C. It has a supply voltage range of 2.25-3V and features EIA-232 interface standard for industrial applications. The package style is small outline, shrink pitch with dual terminal position and nickel/palladium/gold finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,426 parts In-Stock

1+ parts

-

100+ parts

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5,426

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Digiode

USA . 290 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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290

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 279 parts In-Stock

1+ parts

$10.210

100+ parts

-

1k+ parts

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279

$10.210

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Parana Technologies

USA . 2,054 parts In-Stock

1+ parts

$12.433

100+ parts

-

1k+ parts

$12.874

10k+ parts

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2,054

$12.433

-

$12.874

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One Stop Electronics

USA . 482 parts In-Stock

1+ parts

$12.500

100+ parts

-

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482

$12.500

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DigiPath Technology Company

USA . 1,450 parts In-Stock

1+ parts

$13.691

100+ parts

-

1k+ parts

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10k+ parts

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1,450

$13.691

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ChromeModa Solutions

Germany . 6,231 parts In-Stock

1+ parts

$13.970

100+ parts

$11.455

1k+ parts

-

10k+ parts

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6,231

$13.970

$11.455

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IDEA Electronic Components Group

UK . 3 parts In-Stock

1+ parts

$13.970

100+ parts

$13.272

1k+ parts

$12.573

10k+ parts

-

3

$13.970

$13.272

$12.573

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Microchip USA

USA . 2,570 parts In-Stock

1+ parts

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100+ parts

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2,570

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Corphita

USA . 896 parts In-Stock

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896

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Overview

Enhance your communication systems with the Texas Instruments MAX3318EIDBG4 Line Driver & Receiver. Manufactured by the renowned Texas Instruments, this product offers unmatched quality and reliability. Ideal for a wide range of applications, this small outline, shrink pitch package provides true output polarity and Schmitt trigger input characteristics. With a maximum supply voltage of 3V and minimal supply voltage of 2.25V, the MAX3318EIDBG4 ensures industrial-grade performance in any environment. Elevate your projects with this efficient, dual terminal line transceiver today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components.

Surface Mount: YES

Allows for easy installation on circuit boards.

Maximum Supply Voltage: 3 V

Ensures compatibility with various power sources.

No. of Functions: 2

Provides multiple capabilities in a single product.

Package Shape: RECTANGULAR

Facilitates easy integration into existing setups.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even under high temperature conditions.

Minimum Operating Temperature: -40 °C

Maintains functionality in cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Assures quality connections and longevity.

Interface Standard: EIA-232

Follows industry standards for seamless integration with other equipment.

Technical Specifications

Line Drivers & Receivers MAX3318EIDBG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

7.4 V

Maximum Output Low Current:

.5 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.25/3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

2 mA

Maximum Supply Voltage:

3 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Maximum Supply Voltage-1:

3 V

Minimum Supply Voltage-1:

2.25 V

Nominal Supply Voltage-1:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

MAX3318EIDBG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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