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MAX3243CPWRG4

Texas Instruments

MAX3243CPWRG4 by Texas Instruments

MAX3243CPWRG4 by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at 3.6V max supply voltage. It features a small outline package and Schmitt trigger input characteristics, suitable for EIA-232-F, TIA-232-F, V.28 interface standards in commercial temperature grades.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Chip Stock

USA . 72,808 parts In-Stock

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Vyrian

USA . 6,015 parts In-Stock

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Digiode

USA . 2,991 parts In-Stock

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2,991

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Electronics Depot

USA . 68 parts In-Stock

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Vigor

Singapore . 2,500 parts In-Stock

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$0.970

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$0.970

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Parana Technologies

USA . 857 parts In-Stock

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$1.962

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$2.495

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857

$1.962

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$2.495

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ChromeModa Solutions

Germany . 3,092 parts In-Stock

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$2.204

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$1.807

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IDEA Electronic Components Group

UK . 200 parts In-Stock

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$2.204

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$1.984

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Semicontronic

India . 1,356 parts In-Stock

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$9.500

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$9.262

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$9.215

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Corohmni

South Africa . 327 parts In-Stock

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$11.022

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AZTECH Wire

Italy . 646 parts In-Stock

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$15.505

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Ampacity Inc.

Singapore . 1,336 parts In-Stock

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One Stop Electronics

USA . 1,122 parts In-Stock

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Microchip USA

USA . 3,932 parts In-Stock

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Argo Parts USA

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Corphita

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Continental Prestige Electronics

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Perfect Parts

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Bastille Electronics

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DigiPath Technology Company

USA . 159 parts In-Stock

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$1.987

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Overview

Experience unparalleled quality and reliability with the MAX3243CPWRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch performance, making this product a must-have for applications in line drivers & receivers. With its innovative design and advanced technology, the MAX3243CPWRG4 offers customers unmatched value, benefits, and advantages. Trust Texas Instruments to provide you with the best-in-class solutions for all your engineering needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the line driver & receiver.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it compatible with various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement and alignment on a circuit board.

Maximum Transmit Delay: 150 ns

Provides fast and reliable signal transmission, ensuring timely communication between devices.

Power Supplies (V): 3.3/5

Offers flexibility in power supply options, accommodating different voltage requirements for diverse systems.

Maximum High Level Input Current: 0.000001 Amp

Requires minimal input current, leading to energy efficiency and reduced power consumption.

Maximum Output Low Current: 1.6 Amp

Capable of driving relatively high output currents, suitable for powering various components in a circuit.

Receiver No. of Bits: 5

Supports precise and accurate data reception, making it suitable for applications requiring high data resolution.

Maximum Seated Height: 1.2 mm

Compact design with low profile, ideal for space-constrained applications and minimal board clearance.

Input Characteristics: SCHMITT TRIGGER

Ensures reliable signal reception by stabilizing input signals with hysteresis, reducing noise susceptibility.

Temperature Grade: COMMERCIAL

Suitable for standard operating temperatures in commercial environments, offering dependable performance under typical conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption, high noise immunity, and compatibility with a wide range of signal levels.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Complies with industry standards for signal communication, ensuring interoperability with other devices following the same protocols.

Driver No. of Bits: 3

Designed to accurately transmit data with 3-bit resolution, suitable for applications requiring moderate data precision.

Technical Specifications

Line Drivers & Receivers MAX3243CPWRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

CAN ALSO OPERATE WITH 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

5 V

Maximum Output Low Current:

1.6 Amp

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

150 ns

Receiver No. of Bits:

5

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

150 ns

Width:

4.4 mm

Trade Compliance

MAX3243CPWRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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