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MAX3237ECDB

Texas Instruments

MAX3237ECDB by Texas Instruments

MAX3237ECDB by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at 3.6V. It has a small outline package style, Schmitt trigger input characteristics, and supports EIA-232-F interface standard. Ideal for commercial applications requiring reliable data transmission over short distances.

Median Price

$3.220

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 24 parts In-Stock

1+ parts

$3.660

100+ parts

$2.690

1k+ parts

$2.230

10k+ parts

$2.130

24

$3.660

$2.690

$2.230

$2.130

Rochester

USA . 64 parts In-Stock

1+ parts

-

100+ parts

$2.780

1k+ parts

$2.490

10k+ parts

$2.340

64

-

$2.780

$2.490

$2.340

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 348 parts In-Stock

1+ parts

$1.805

100+ parts

-

1k+ parts

-

10k+ parts

-

348

$1.805

-

-

-

Vyrian

USA . 7,651 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,651

-

-

-

-

Chip Stock

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,691 parts In-Stock

1+ parts

$1.710

100+ parts

-

1k+ parts

-

10k+ parts

-

2,691

$1.710

-

-

-

Parana Technologies

USA . 2,156 parts In-Stock

1+ parts

$7.339

100+ parts

-

1k+ parts

$7.831

10k+ parts

-

2,156

$7.339

-

$7.831

-

DigiPath Technology Company

USA . 1,780 parts In-Stock

1+ parts

$8.081

100+ parts

$7.435

1k+ parts

-

10k+ parts

-

1,780

$8.081

$7.435

-

-

ChromeModa Solutions

Germany . 3,294 parts In-Stock

1+ parts

$8.246

100+ parts

$6.762

1k+ parts

-

10k+ parts

-

3,294

$8.246

$6.762

-

-

IDEA Electronic Components Group

UK . 1,646 parts In-Stock

1+ parts

$8.246

100+ parts

-

1k+ parts

$7.421

10k+ parts

-

1,646

$8.246

-

$7.421

-

QUARKTWIN TECHNOLOGY LTD

USA . 15,071 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,071

-

-

-

-

Perfect Parts

USA . 616 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

616

-

-

-

-

Metaverse IC Inc.

Canada . 376 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

376

-

-

-

-

Kepictronics

USA . 276 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

276

-

-

-

-

Overview

Upgrade your communication systems with the Texas Instruments MAX3237ECDB Line Driver & Receiver. With a reputation for superior quality and reliability, Texas Instruments delivers a product that exceeds expectations. Ideal for a wide range of applications, this small outline, shrink pitch package offers customers unmatched value and benefits. Experience seamless connectivity and enhanced performance with the MAX3237ECDB - the ultimate choice for your communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for portable devices.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this product is compatible with a wide range of power sources, providing flexibility in use.

No. of Functions: 3

Having multiple functions in one device reduces the need for additional components, saving costs and simplifying circuit design.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of board space and easy integration into existing designs.

Power Supplies (V): 3.3/5

Supporting multiple power supply voltages (3.3V and 5V) makes this product versatile and compatible with different systems.

No. of Terminals: 28

Having a high number of terminals provides more connectivity options and flexibility in circuit connections.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows for reliable performance in varying environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can function in cold environments without issues.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Compliance with multiple interface standards ensures compatibility with a wide range of devices and systems.

Technical Specifications

Line Drivers & Receivers MAX3237ECDB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

5

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

.001 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

150 ns

Receiver No. of Bits:

3

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

2 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

MAX3237ECDB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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