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MAX3232CDBG4

Texas Instruments

MAX3232CDBG4 by Texas Instruments

MAX3232CDBG4 by Texas Instruments is a Line Driver & Receiver with 16 terminals, operating at 3.3/5V. It features inverted output polarity, Schmitt trigger input characteristics, and EIA-232-F interface standard. Ideal for applications requiring reliable data transmission in commercial temperature range of 0-70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,277 parts In-Stock

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Digiode

USA . 2,333 parts In-Stock

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2,333

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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AZTECH Wire

Italy . 614 parts In-Stock

1+ parts

$5.636

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614

$5.636

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Parana Technologies

USA . 1,556 parts In-Stock

1+ parts

$10.870

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$11.348

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1,556

$10.870

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$11.348

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DigiPath Technology Company

USA . 225 parts In-Stock

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$11.970

100+ parts

$11.012

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225

$11.970

$11.012

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ChromeModa Solutions

Germany . 1,898 parts In-Stock

1+ parts

$12.214

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$10.015

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1,898

$12.214

$10.015

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IDEA Electronic Components Group

UK . 1,304 parts In-Stock

1+ parts

$12.214

100+ parts

$11.603

1k+ parts

$10.993

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1,304

$12.214

$11.603

$10.993

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One Stop Electronics

USA . 1,345 parts In-Stock

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$30.500

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$30.500

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Ampacity Inc.

Singapore . 335 parts In-Stock

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$37.500

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335

$37.500

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Corphita

USA . 2,606 parts In-Stock

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2,606

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Microchip USA

USA . 394 parts In-Stock

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Perfect Parts

USA . 200 parts In-Stock

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Overview

Upgrade your communication systems with the MAX3232CDBG4 by Texas Instruments, a top-of-the-line line driver and receiver delivering unmatched quality and reliability. Manufactured by industry leader Texas Instruments, this product offers a wide range of applications, ensuring seamless data transmission in various settings. With its superior performance and durable construction, the MAX3232CDBG4 guarantees optimal efficiency and precision. Trust in Texas Instruments to provide the cutting-edge technology you need for your next project. Elevate your systems with the MAX3232CDBG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers durability and protection for the internal components of the line driver & receiver, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying assembly.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this line driver & receiver can perform reliably in a wide range of environmental conditions, suitable for various applications.

No. of Functions: 2

Having 2 functions in one device offers added versatility and functionality, making it a cost-effective and space-saving solution.

Maximum Supply Voltage: 3.6 V

Operating within a maximum supply voltage of 3.6 V ensures compatibility with a range of systems while providing reliable performance.

Input Characteristics: SCHMITT TRIGGER

The Schmitt trigger input characteristics help in eliminating noise and signal distortion, resulting in a more stable and accurate signal transmission.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Compliance with standard interfaces like EIA-232-F, TIA-232-F, and V.28 ensures interoperability with a wide range of equipment and systems.

Technical Specifications

Line Drivers & Receivers MAX3232CDBG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

CAN ALSO OPERATE WITH 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

.001 Amp

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

300 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

300 ns

Width:

5.3 mm

Trade Compliance

MAX3232CDBG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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