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MAX3232CDB

Texas Instruments

MAX3232CDB by Texas Instruments

MAX3232CDB by Texas Instruments is a Line Driver & Receiver with 16 terminals. It operates at 3.3/5V, has a max supply voltage of 3.6V, and offers inverted output polarity. Ideal for EIA-232-F, TIA-232-F, V.28 interfaces in commercial temperature grades applications.

Median Price

$2.680

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 220 parts In-Stock

1+ parts

$2.680

100+ parts

$1.940

1k+ parts

$1.590

10k+ parts

$1.180

220

$2.680

$1.940

$1.590

$1.180

Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

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$2.020

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$2.020

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Digiode

USA . 3,039 parts In-Stock

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$2.546

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Vyrian

USA . 6,325 parts In-Stock

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Bristol Electronics

USA . 331 parts In-Stock

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A&K Electronics

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Rotakorn

Sweden . 110 parts In-Stock

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Flex Direct, LLC

USA . 89 parts In-Stock

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Atlantic Semiconductor

USA . 85 parts In-Stock

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ComSIT Distribution GmbH

Germany . 56 parts In-Stock

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Connector Distribution Corp

USA . 23 parts In-Stock

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Right Parts Inc.

USA . 23 parts In-Stock

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Prism Electronics

USA . 1 parts In-Stock

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$1.938

100+ parts

$1.938

1k+ parts

$1.938

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-

2,500

$1.938

$1.938

$1.938

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Continental Prestige Electronics

USA . 6,988 parts In-Stock

1+ parts

$2.020

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$1.980

6,988

$2.020

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$1.980

Argo Parts USA

USA . 4,678 parts In-Stock

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$2.020

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Ampacity Inc.

Singapore . 203 parts In-Stock

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$2.280

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$2.280

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Semicontronic

India . 6 parts In-Stock

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$2.280

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$2.223

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$2.212

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$2.280

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$2.212

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Corphita

USA . 814 parts In-Stock

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$2.412

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$2.412

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Corohmni

South Africa . 68 parts In-Stock

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$5.620

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$5.620

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Parana Technologies

USA . 500 parts In-Stock

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$7.906

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$8.463

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$7.906

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$8.463

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ChromeModa Solutions

Germany . 6,031 parts In-Stock

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$8.883

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$7.284

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$8.883

$7.284

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IDEA Electronic Components Group

UK . 1,853 parts In-Stock

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$8.883

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$8.439

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$7.995

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$8.883

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$7.995

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AZTECH Wire

Italy . 418 parts In-Stock

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$19.762

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XScomponents

USA . 10,582 parts In-Stock

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$1.660

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DigiPath Technology Company

USA . 697 parts In-Stock

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$8.009

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Microchip USA

USA . 377 parts In-Stock

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Kepictronics

USA . 65 parts In-Stock

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Overview

Elevate your communications with the MAX3232CDB from Texas Instruments. As a leader in the industry, Texas Instruments delivers exceptional quality and reliability in their products. The MAX3232CDB is a versatile Line Driver & Receiver that offers seamless integration and superior performance. Ideal for a wide range of applications, this product provides value through its efficiency and precision. Experience the benefits of Texas Instruments' expertise with the MAX3232CDB - your solution for high-quality communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body makes this product lightweight and durable, ideal for portable devices.

Surface Mount: YES

The surface mount feature allows for easy installation and saves space on the PCB, making it suitable for compact designs.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this product is compatible with a wide range of power sources, enhancing its versatility.

No. of Functions: 2

Featuring 2 functions in one package, this product offers cost-effective solutions for multiple signal processing needs.

Package Shape: RECTANGULAR

The rectangular package shape simplifies the mounting process and ensures easy integration into existing systems.

Maximum Transmit Delay: 300 ns

With a maximum transmit delay of 300ns, this product ensures fast data transmission, suitable for high-speed communication applications.

Maximum Supply Voltage-1: 3.6 V

The extended maximum supply voltage capability of 3.6V provides added flexibility in power source selection, enhancing the product's performance.

Power Supplies (V): 3.3/5

Supporting power supplies of 3.3V and 5V, this product is compatible with a wide range of electronic devices, making it a versatile choice.

No. of Terminals: 16

With 16 terminals, this product offers multiple input and output options, allowing for complex signal routing configurations.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style saves space on the PCB, making it suitable for compact designs in crowded electronic assemblies.

Technical Specifications

Line Drivers & Receivers MAX3232CDB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

CAN ALSO OPERATE WITH 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

.001 Amp

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

300 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

300 ns

Width:

5.3 mm

Trade Compliance

MAX3232CDB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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