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M4FR5969SPHPT-MLS

Texas Instruments

M4FR5969SPHPT-MLS by Texas Instruments

M4FR5969SPHPT-MLS by Texas Instruments is a 16-bit microcontroller with 2048 bytes of RAM, operating at a max frequency of 24 MHz. It features 16 ADC channels and DMA support, suitable for applications requiring low power consumption and high processing speed. With connectivity options like I2C, SPI, and UART, it is ideal for IoT devices and sensor networks.

Median Price

$2,544.696

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 757 parts In-Stock

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$2,544.696

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757

$2,544.696

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Distributors (In-Stock)

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Digiode

USA . 280 parts In-Stock

1+ parts

$2,417.461

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280

$2,417.461

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Vyrian

USA . 7,082 parts In-Stock

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7,082

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Distributors (Availability)

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Microchip USA

USA . 1,516 parts In-Stock

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$1.000

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$1.000

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$1.000

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$1.000

1,516

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$1.000

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$1.000

AZTECH Wire

Italy . 522 parts In-Stock

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$15.970

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522

$15.970

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Advanced Electronics

New Zealand . 24 parts In-Stock

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$39.472

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$35.920

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$32.367

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24

$39.472

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$32.367

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Parana Technologies

USA . 1,209 parts In-Stock

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$58.611

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1,209

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DigiPath Technology Company

USA . 1,259 parts In-Stock

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$64.538

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$59.375

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IDEA Electronic Components Group

UK . 1,424 parts In-Stock

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$65.855

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$62.562

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$59.270

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1,424

$65.855

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$59.270

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ChromeModa Solutions

Germany . 514 parts In-Stock

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$65.855

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$54.001

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514

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Corphita

USA . 2,560 parts In-Stock

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$2,290.226

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Overview

Discover the Texas Instruments M4FR5969SPHPT-MLS Microcontroller, a top-quality product designed to elevate your projects to the next level. With advanced technology and precision engineering from a trusted manufacturer, this microcontroller offers unparalleled performance and reliability. Ideal for a wide range of applications, from IoT devices to industrial automation, this compact yet powerful device boasts numerous features such as ADC channels, DMA capabilities, and a high clock frequency. Unlock endless possibilities with the Texas Instruments M4FR5969SPHPT-MLS Microcontroller and experience the difference in efficiency and innovation it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, ensuring long-lasting performance.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile and compatible with various power sources.

Bit Size: 16

16-bit architecture provides higher precision and performance compared to lower bit sizes, making it suitable for complex applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers faster processing speeds and more efficient operation, enhancing overall performance of the microcontroller.

RAM Bytes: 2048

Ample RAM storage allows for efficient data processing and multitasking capabilities, making it ideal for handling complex tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring energy efficiency and stable operation of the microcontroller.

ADC Channels: YES

Built-in ADC channels enable analog-to-digital conversion, allowing the microcontroller to interface with sensory input devices and process real-world data.

Connectivity: I2C, SPI(3), UART(2)

Multiple connectivity options such as I2C, SPI, and UART facilitate communication with external devices, expanding the microcontroller's functionality and usability.

Technical Specifications

Microcontrollers M4FR5969SPHPT-MLS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

40

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-55 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

0

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(3), UART(2)

Peripherals:

COMPARATOR(16), DMA, RTC, TIMER(5)

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

M4FR5969SPHPT-MLS Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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