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LVC1T45MDCKREPG4

Texas Instruments

LVC1T45MDCKREPG4 by Texas Instruments

LVC1T45MDCKREPG4 by Texas Instruments is a 6-terminal bus driver with translation capabilities b/w 1.8V and 5V, suitable for bidirectional applications. It features a max I (ol) of 24A, propagation delay of 20.7ns, and operates in temperatures ranging from -55°C to 125°C. Ideal for military-grade electronics requiring true output polarity control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,921 parts In-Stock

1+ parts

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5,921

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Digiode

USA . 4,403 parts In-Stock

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4,403

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Distributors (Availability)

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Andel Nordic

Denmark . 24 parts In-Stock

1+ parts

$5.208

100+ parts

-

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$5.000

10k+ parts

$5.000

24

$5.208

-

$5.000

$5.000

Parana Technologies

USA . 1,874 parts In-Stock

1+ parts

$12.067

100+ parts

-

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$12.476

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1,874

$12.067

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$12.476

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AZTECH Wire

Italy . 485 parts In-Stock

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$12.597

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485

$12.597

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DigiPath Technology Company

USA . 301 parts In-Stock

1+ parts

$13.287

100+ parts

$12.224

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301

$13.287

$12.224

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IDEA Electronic Components Group

UK . 2,272 parts In-Stock

1+ parts

$13.558

100+ parts

$12.880

1k+ parts

$12.202

10k+ parts

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2,272

$13.558

$12.880

$12.202

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ChromeModa Solutions

Germany . 1,710 parts In-Stock

1+ parts

$13.558

100+ parts

$11.118

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1,710

$13.558

$11.118

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One Stop Electronics

USA . 1,023 parts In-Stock

1+ parts

$17.000

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1,023

$17.000

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Kepictronics

USA . 6,200 parts In-Stock

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6,200

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Corphita

USA . 792 parts In-Stock

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792

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Overview

Experience cutting-edge technology with the LVC1T45MDCKREPG4 by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-quality products that exceed expectations. This bus driver & transceiver offers seamless translation capabilities, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this versatile component is designed to enhance performance and reliability. Trust Texas Instruments to deliver superior value and innovation with the LVC1T45MDCKREPG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and durable, making it a good choice for mobile applications.

Surface Mount: YES

The surface mount capability of this product allows for easy and efficient installation on a circuit board, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage of 1.8V makes this product energy-efficient, reducing power consumption and extending battery life in portable devices.

Propagation Delay (tpd): 20.7 ns

The low propagation delay of 20.7 nanoseconds ensures fast signal transmission, making this product suitable for high-speed data communication applications.

Temperature Grade: MILITARY

The military-grade temperature tolerance of this product ensures reliable operation in harsh environmental conditions, making it a suitable choice for defense or aerospace applications.

Technical Specifications

Bus Driver & Transceivers LVC1T45MDCKREPG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay (tpd):

20.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.8/5V&1.8/5V

Width:

1.25 mm

Trade Compliance

LVC1T45MDCKREPG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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