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LT1039-16CN

Texas Instruments

LT1039-16CN by Texas Instruments

LT1039-16CN by Texas Instruments is a Line Driver & Receiver with 16 terminals, operating at temperatures from 0 to 70°C. It has a power supply of ±12V, max output low current of 1.6A, and min output swing of 22.1V. Ideal for commercial applications requiring bipolar technology in an in-line package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,028 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,028

-

-

-

-

Digiode

USA . 459 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

459

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 507 parts In-Stock

1+ parts

$1.500

100+ parts

-

1k+ parts

-

10k+ parts

-

507

$1.500

-

-

-

Parana Technologies

USA . 743 parts In-Stock

1+ parts

$6.990

100+ parts

-

1k+ parts

$7.557

10k+ parts

-

743

$6.990

-

$7.557

-

DigiPath Technology Company

USA . 626 parts In-Stock

1+ parts

$7.697

100+ parts

$7.081

1k+ parts

-

10k+ parts

-

626

$7.697

$7.081

-

-

ChromeModa Solutions

Germany . 2,417 parts In-Stock

1+ parts

$7.854

100+ parts

$6.440

1k+ parts

-

10k+ parts

-

2,417

$7.854

$6.440

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IDEA Electronic Components Group

UK . 1,589 parts In-Stock

1+ parts

$7.854

100+ parts

-

1k+ parts

$7.069

10k+ parts

-

1,589

$7.854

-

$7.069

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AZTECH Wire

Italy . 613 parts In-Stock

1+ parts

$18.249

100+ parts

-

1k+ parts

-

10k+ parts

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613

$18.249

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-

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Corphita

USA . 4,470 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,470

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Overview

Enhance your electronic designs with the LT1039-16CN from Texas Instruments, a top-tier manufacturer known for innovation and reliability. As a leader in Line Drivers & Receivers, this product offers exceptional quality, performance, and versatility. With a durable plastic/epoxy package, wide power supply range, and dual terminal position, it caters to a variety of applications. Experience the value of seamless data transmission, enhanced signal integrity, and efficient power consumption with the LT1039-16CN. Upgrade your projects today with this cutting-edge technology from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the line driver & receiver.

Power Supplies (V): 5,+-12

The wide range of power supplies (5V and +/-12V) allows flexibility in various electronic systems and applications.

No. of Terminals: 16

Having 16 terminals enables the line driver & receiver to handle multiple input and output connections efficiently.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance even in challenging environments.

Technology: BIPOLAR

The bipolar technology used in this line driver & receiver provides accurate signal amplification and transmission for superior performance.

Technical Specifications

Line Drivers & Receivers LT1039-16CN attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.00002 Amp

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

22.1 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5,+-12

Qualification:

Not Qualified

Sub-Category:

Line Driver or Receivers

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

LT1039-16CN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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