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LP395Z/LFT1

Texas Instruments

LP395Z/LFT1 by Texas Instruments

LP395Z/LFT1 by Texas Instruments is a NPN BJT in a cylindrical package with matte tin finish. It operates up to 125°C, suitable for small signal applications like amplifiers and switching circuits. With single configuration and through-hole terminals, it offers reliable performance in various electronic designs.

Median Price

$3.030

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 134,575 parts In-Stock

1+ parts

$1.218

100+ parts

$0.937

1k+ parts

$0.493

10k+ parts

-

134,575

$1.218

$0.937

$0.493

-

DigiKey

USA . 4,972 parts In-Stock

1+ parts

$3.030

100+ parts

$1.350

1k+ parts

$1.048

10k+ parts

-

4,972

$3.030

$1.350

$1.048

-

Mouser Electronics

USA . 800 parts In-Stock

1+ parts

$3.030

100+ parts

$1.350

1k+ parts

$1.050

10k+ parts

$0.856

800

$3.030

$1.350

$1.050

$0.856

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.784

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$0.784

-

-

-

Digiode

USA . 3,576 parts In-Stock

1+ parts

$1.157

100+ parts

-

1k+ parts

-

10k+ parts

-

3,576

$1.157

-

-

-

Vyrian

USA . 46,875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

46,875

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.768

100+ parts

-

1k+ parts

$0.737

10k+ parts

-

2,000

$0.768

-

$0.737

-

Continental Prestige Electronics

USA . 4,382 parts In-Stock

1+ parts

$0.784

100+ parts

-

1k+ parts

-

10k+ parts

$0.768

4,382

$0.784

-

-

$0.768

Argo Parts USA

USA . 3,470 parts In-Stock

1+ parts

$0.784

100+ parts

-

1k+ parts

-

10k+ parts

-

3,470

$0.784

-

-

-

Parana Technologies

USA . 734 parts In-Stock

1+ parts

$0.784

100+ parts

-

1k+ parts

$1.773

10k+ parts

-

734

$0.784

-

$1.773

-

Corohmni

South Africa . 94 parts In-Stock

1+ parts

$0.789

100+ parts

-

1k+ parts

-

10k+ parts

-

94

$0.789

-

-

-

DigiPath Technology Company

USA . 1,050 parts In-Stock

1+ parts

$0.863

100+ parts

$0.794

1k+ parts

-

10k+ parts

-

1,050

$0.863

$0.794

-

-

ChromeModa Solutions

Germany . 3,464 parts In-Stock

1+ parts

$0.881

100+ parts

$0.722

1k+ parts

-

10k+ parts

-

3,464

$0.881

$0.722

-

-

IDEA Electronic Components Group

UK . 1,370 parts In-Stock

1+ parts

$0.881

100+ parts

-

1k+ parts

$0.793

10k+ parts

-

1,370

$0.881

-

$0.793

-

Semicontronic

India . 47,288 parts In-Stock

1+ parts

$1.040

100+ parts

$1.014

1k+ parts

$1.009

10k+ parts

-

47,288

$1.040

$1.014

$1.009

-

Ampacity Inc.

Singapore . 47,245 parts In-Stock

1+ parts

$1.040

100+ parts

-

1k+ parts

-

10k+ parts

-

47,245

$1.040

-

-

-

Corphita

USA . 3,966 parts In-Stock

1+ parts

$1.096

100+ parts

-

1k+ parts

-

10k+ parts

-

3,966

$1.096

-

-

-

Lixinc

USA . 4,757 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,757

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the LP395Z/LFT1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability in every product. The LP395Z/LFT1 falls under the category of Small Signal Bipolar Junction Transistors (BJT), making it versatile for a wide range of applications. With its NPN polarity, single configuration, and through-hole terminal form, this transistor offers unmatched performance and efficiency. Experience seamless integration and enhanced functionality with the LP395Z/LFT1, providing customers with value, benefits, and advantages that set it apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials ensure lightweight and durable construction, making this transistor suitable for various applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used for amplification and switching applications, providing reliable performance.

Configuration: SINGLE

Single configuration simplifies circuit design and integration, making it easier to use in projects.

Package Shape: ROUND

Round package shape allows for easy mounting and placement on circuit boards, optimizing space utilization.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easier soldering, ensuring reliable conductivity.

Package Style (Meter): CYLINDRICAL

Cylindrical package style offers a compact and standardized design, helping with compatibility and flexibility in installation.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this transistor can withstand high temperatures, suitable for demanding environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring long-term reliability in electrical connections.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure mounting on PCBs, facilitating efficient assembly and maintenance.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) LP395Z/LFT1 attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Texas Instruments

Specs

Configuration:

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e3

No. of Elements:

1

Maximum Operating Temperature:

125 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

NPN

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Trade Compliance

LP395Z/LFT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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