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LP2967IBPX-2528

Texas Instruments

LP2967IBPX-2528 by Texas Instruments

LP2967IBPX-2528 by Texas Instruments is a fixed positive multiple output LDO regulator with 2.5V and 2.8V nominal output voltages, suitable for applications requiring low dropout voltage of 0.425V. It features a compact grid array package with very thin profile and fine pitch terminals, making it ideal for space-constrained designs in various electronic devices. Operating temperature range from -40°C to 125°C ensures reliable performance in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,740 parts In-Stock

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Digiode

USA . 4,126 parts In-Stock

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Anansix

USA . 1,381 parts In-Stock

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Parana Technologies

USA . 1,940 parts In-Stock

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$5.536

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$6.299

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1,940

$5.536

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$6.299

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IDEA Electronic Components Group

UK . 725 parts In-Stock

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$6.220

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$5.598

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725

$6.220

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ChromeModa Solutions

Germany . 431 parts In-Stock

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$6.220

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$5.100

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431

$6.220

$5.100

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AZTECH Wire

Italy . 524 parts In-Stock

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$18.512

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524

$18.512

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One Stop Electronics

USA . 198 parts In-Stock

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$23.500

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198

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Kepictronics

USA . 18,000 parts In-Stock

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Corphita

USA . 4,787 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,200 parts In-Stock

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DigiPath Technology Company

USA . 674 parts In-Stock

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$5.608

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674

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Overview

Upgrade your power management solutions with the LP2967IBPX-2528 by Texas Instruments. This fixed positive multiple output LDO regulator offers unparalleled quality and reliability, ensuring optimal performance in a variety of applications. From consumer electronics to industrial equipment, this regulator delivers precise voltage regulation and low dropout voltage, guaranteeing smooth operation and efficient power delivery. Trust Texas Instruments for cutting-edge technology that adds value to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Offers durability and protection for the internal components of the regulator.

Maximum Dropout Voltage-2: 2.425 V

Provides efficient regulation and ensures stable output voltage even with varying input voltage.

Surface Mount: YES

Enables easy and convenient mounting on PCBs, saving space and simplifying the assembly process.

Operating Temperature (TJ-Max): 125 °C

Allows the regulator to operate reliably in high temperature environments.

Maximum Voltage Tolerance: 3 %

Ensures tight voltage regulation, making it suitable for sensitive electronic devices.

Regulator Type: FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR

Provides multiple stable output voltages for different components in the circuit.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO LP2967IBPX-2528 attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Texas Instruments

Specs

Maximum Dropout Voltage-1:

.425 V

Maximum Dropout Voltage-2:

.425 V

Maximum Input Voltage:

16 V

Minimum Input Voltage:

3.5 V

JESD-30 Code:

R-PBGA-B8

Length:

1.946 mm

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Current-2:

.15 A

Maximum Output Voltage-1:

2.575 V

Minimum Output Voltage-1:

2.425 V

Nominal Output Voltage-1:

2.5 V

Maximum Output Voltage-2:

2.884 V

Minimum Output Voltage-2:

2.716 V

Nominal Output Voltage-2:

2.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

RECTANGULAR

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.85 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Voltage Tolerance:

3 %

Width:

1.412 mm

Trade Compliance

LP2967IBPX-2528 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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