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LP2967IBP-2533

Texas Instruments

LP2967IBP-2533 by Texas Instruments

LP2967IBP-2533 by Texas Instruments is a fixed positive multiple output LDO regulator with 2 outputs. It has a max input voltage of 16V and can provide up to 0.15A output current per channel. With a package style of grid array, it is suitable for applications requiring precise voltage regulation in compact spaces.

Median Price

$1.180

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$1.180

1k+ parts

$0.979

10k+ parts

$0.873

500

-

$1.180

$0.979

$0.873

DigiKey

USA . 500 parts In-Stock

1+ parts

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$1.000

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$1.000

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Verical

USA . 500 parts In-Stock

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$1.224

10k+ parts

$1.091

500

-

-

$1.224

$1.091

Distributors (In-Stock)

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Digiode

USA . 1,646 parts In-Stock

1+ parts

$0.916

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1,646

$0.916

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Vyrian

USA . 5,019 parts In-Stock

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Anansix

USA . 2,115 parts In-Stock

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DigiKey Marketplace

USA . 500 parts In-Stock

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500

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Connector Distribution Corp

USA . 250 parts In-Stock

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250

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Right Parts Inc.

USA . 250 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,020 parts In-Stock

1+ parts

$0.868

100+ parts

-

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1,020

$0.868

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Vigor

Singapore . 500 parts In-Stock

1+ parts

$0.930

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$0.930

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Parana Technologies

USA . 971 parts In-Stock

1+ parts

$6.356

100+ parts

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$7.110

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971

$6.356

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$7.110

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ChromeModa Solutions

Germany . 1,691 parts In-Stock

1+ parts

$7.142

100+ parts

$5.856

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1,691

$7.142

$5.856

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IDEA Electronic Components Group

UK . 475 parts In-Stock

1+ parts

$7.142

100+ parts

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$6.428

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475

$7.142

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$6.428

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QUARKTWIN TECHNOLOGY LTD

USA . 28,029 parts In-Stock

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28,029

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DigiPath Technology Company

USA . 1,534 parts In-Stock

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100+ parts

$6.439

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1,534

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$6.439

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Overview

Elevate your electronics with the LP2967IBP-2533 by Texas Instruments, a top-of-the-line fixed regulator that promises unparalleled quality and reliability. Manufactured with precision and expertise, this LDO offers multiple positive outputs, making it an essential component for various applications. From ensuring stable power supply to maximizing efficiency, this product delivers unmatched value to customers seeking superior performance. Upgrade your devices today with the LP2967IBP-2533 and experience the exceptional benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Maximum Dropout Voltage-2: 2.425 V

Low dropout voltage ensures efficient power conversion and minimal power loss.

Surface Mount: YES

Enables easy and convenient installation on circuit boards.

Operating Temperature (TJ-Max): 125 °C

Wide operating temperature range allows for versatility in various applications.

No. of Terminals: 8

Sufficient number of terminals for connecting inputs and outputs efficiently.

Nominal Output Voltage-1: 2.5 V

Stable output voltage for consistent performance of connected devices.

Maximum Output Current-1: 0.15 A

Adequate output current for powering multiple devices simultaneously.

Maximum Input Voltage: 16 V

Supports a wide range of input voltages for versatile use in different setups.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO LP2967IBP-2533 attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Texas Instruments

Specs

Maximum Dropout Voltage-1:

.425 V

Maximum Dropout Voltage-2:

.425 V

Maximum Input Voltage:

16 V

Minimum Input Voltage:

3.5 V

JESD-30 Code:

R-PBGA-B8

Length:

1.946 mm

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Current-2:

.15 A

Maximum Output Voltage-1:

2.575 V

Minimum Output Voltage-1:

2.425 V

Nominal Output Voltage-1:

2.5 V

Maximum Output Voltage-2:

3.399 V

Minimum Output Voltage-2:

3.201 V

Nominal Output Voltage-2:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

RECTANGULAR

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.85 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

1.412 mm

Trade Compliance

LP2967IBP-2533 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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