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LMX2531LQX2570E

Texas Instruments

LMX2531LQX2570E by Texas Instruments

LMX2531LQX2570E by Texas Instruments is a PLL frequency synthesizer with 36 terminals, operating temperature range of -40 to 85°C, and supply voltage from 2.8V to 3.2V. It features a square package shape suitable for industrial applications requiring precise frequency synthesis in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,858 parts In-Stock

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5,858

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Digiode

USA . 2,988 parts In-Stock

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2,988

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Anansix

USA . 111 parts In-Stock

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111

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Distributors (Availability)

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One Stop Electronics

USA . 1,032 parts In-Stock

1+ parts

$5.500

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1,032

$5.500

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Parana Technologies

USA . 1,504 parts In-Stock

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$10.711

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$11.198

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1,504

$10.711

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$11.198

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DigiPath Technology Company

USA . 1,476 parts In-Stock

1+ parts

$11.794

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$10.851

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1,476

$11.794

$10.851

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ChromeModa Solutions

Germany . 6,908 parts In-Stock

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$12.035

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$9.869

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6,908

$12.035

$9.869

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IDEA Electronic Components Group

UK . 2,237 parts In-Stock

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$12.035

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$11.433

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$10.832

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2,237

$12.035

$11.433

$10.832

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AZTECH Wire

Italy . 722 parts In-Stock

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$12.513

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722

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Corphita

USA . 5,062 parts In-Stock

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5,062

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Overview

Enhance your electronic projects with the cutting-edge LMX2531LQX2570E by Texas Instruments! As a leader in Phase Locked Loops & Frequency Synthesis Circuits, Texas Instruments guarantees top-notch quality and reliability. This surface-mountable PLL Frequency Synthesizer offers unparalleled performance and precision, making it ideal for a wide range of applications. With a compact square package design, industrial-grade temperature tolerance, and advanced BICMOS technology, this product provides unmatched value and efficiency. Elevate your designs with the LMX2531LQX2570E and experience the difference today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy integration and PCB assembly, making this product suitable for compact and efficient electronic devices.

Nominal Supply Voltage (Vsup): 3 V

Operating at a nominal supply voltage of 3V ensures compatibility with a wide range of electronic systems and power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand demanding environmental conditions and ensure reliable performance in various applications.

Technology: BICMOS

Utilizing Bipolar-CMOS technology provides a balance between high-performance analog functions and low-power digital processing, making this product versatile and efficient in signal processing applications.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2531LQX2570E attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e0

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.2 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

LMX2531LQX2570E Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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