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LMX2512LQ1065

Texas Instruments

LMX2512LQ1065 by Texas Instruments

LMX2512LQ1065 by Texas Instruments is a PLL frequency synthesizer with 28 terminals, operating voltage of 2.7-3.3V, and max supply current of 21mA. It is used in applications requiring precise frequency synthesis and phase-locked loops, with a package style of very thin profile chip carrier suitable for surface mount assembly. Operating temperature range from -30 to 85°C makes it versatile for various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,828 parts In-Stock

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Anansix

USA . 2,388 parts In-Stock

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2,388

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Digiode

USA . 1,769 parts In-Stock

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One Stop Electronics

USA . 1,280 parts In-Stock

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$6.500

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1,280

$6.500

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Parana Technologies

USA . 24 parts In-Stock

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$11.900

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$12.296

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24

$11.900

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$12.296

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DigiPath Technology Company

USA . 974 parts In-Stock

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$13.104

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$12.055

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974

$13.104

$12.055

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ChromeModa Solutions

Germany . 2,614 parts In-Stock

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$13.371

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$10.964

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2,614

$13.371

$10.964

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IDEA Electronic Components Group

UK . 490 parts In-Stock

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$13.371

100+ parts

$12.702

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$12.034

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490

$13.371

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$12.034

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AZTECH Wire

Italy . 656 parts In-Stock

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$14.244

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$14.244

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Alle Elektronik GmbH

Germany . 4,993 parts In-Stock

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Corphita

USA . 4,392 parts In-Stock

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Kepictronics

USA . 2,600 parts In-Stock

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Overview

Unlock the power of precision frequency synthesis with the LMX2512LQ1065 by Texas Instruments. Designed with top-notch quality and reliability, this PLL frequency synthesizer offers unparalleled performance in a compact square chip carrier package. Ideal for applications requiring precise frequency control, this innovative product ensures optimal signal integrity and stability. Trust Texas Instruments to deliver cutting-edge solutions that meet your needs and exceed your expectations. Elevate your designs with the LMX2512LQ1065 and experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy and efficient integration onto circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape provides uniformity and ease of handling during installation and maintenance.

Nominal Supply Voltage (Vsup): 2.8 V

Operating at a low supply voltage of 2.8V helps in reducing power consumption and heat generation.

No. of Terminals: 28

Having 28 terminals allows for more connectivity options and flexibility in designing circuits.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The chip carrier package with a very thin profile enables a compact design while ensuring structural integrity.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85C, the product can withstand challenging environmental conditions.

Minimum Operating Temperature: -30 °C

The wide temperature range from -30C to 85C allows for reliable performance in diverse operating environments.

Terminal Finish: Tin/Lead (Sn85Pb15)

Tin/Lead terminal finish ensures good solderability and longevity of the product.

Maximum Supply Current (Isup): 21 mA

Low maximum supply current of 21mA indicates energy efficiency and minimal power consumption.

Moisture Sensitivity Level (MSL): 2

MSL level of 2 signifies moderate sensitivity to moisture, prompting proper handling and storage procedures.

Maximum Supply Voltage (Vsup): 3.3 V

With a maximum supply voltage of 3.3V, the product offers compatibility with a wide range of power sources.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2512LQ1065 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e0

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.8

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

21 mA

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

2.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn85Pb15)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

5 mm

Trade Compliance

LMX2512LQ1065 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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