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LMX2433TMX

Texas Instruments

LMX2433TMX by Texas Instruments

LMX2433TMX by Texas Instruments is a PLL frequency synthesizer with 20 terminals, operating at temperatures from -40 to 85°C. It has a supply voltage range of 2.25V to 2.75V and consumes up to 4.4mA current. This IC is ideal for applications requiring precise frequency synthesis in industrial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,957 parts In-Stock

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Digiode

USA . 3,765 parts In-Stock

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3,765

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Anansix

USA . 2,725 parts In-Stock

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One Stop Electronics

USA . 1,597 parts In-Stock

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$6.500

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$6.500

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AZTECH Wire

Italy . 750 parts In-Stock

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$13.663

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750

$13.663

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Parana Technologies

USA . 2,176 parts In-Stock

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$20.541

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$20.619

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2,176

$20.541

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$20.619

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ChromeModa Solutions

Germany . 5,465 parts In-Stock

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$23.080

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$18.926

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$23.080

$18.926

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IDEA Electronic Components Group

UK . 377 parts In-Stock

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$23.080

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$21.926

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$20.772

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377

$23.080

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$20.772

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Corphita

USA . 3,789 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,301 parts In-Stock

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DigiPath Technology Company

USA . 747 parts In-Stock

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$20.809

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Microchip USA

USA . 293 parts In-Stock

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Overview

With the LMX2433TMX by Texas Instruments, you can experience unparalleled quality and reliability in Phase Locked Loops (PLL) & Frequency Synthesis Circuits. Manufactured with precision and expertise, this product offers a wide range of applications for various industries. From telecommunications to aerospace, the LMX2433TMX provides unmatched performance and efficiency. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Upgrade your projects with the value and benefits that only the LMX2433TMX can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and impact resistance, making the product suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on PCBs.

Nominal Supply Voltage (Vsup): 2.5 V

The voltage requirement is within a common range, ensuring compatibility with many systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in demanding conditions.

Terminal Position: DUAL

Dual terminal position provides flexibility in connecting the device within a circuit.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2433TMX attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

4.4 mA

Maximum Supply Voltage (Vsup):

2.75 V

Minimum Supply Voltage (Vsup):

2.25 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LMX2433TMX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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