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LMX2336LSLBX

Texas Instruments

LMX2336LSLBX by Texas Instruments

LMX2336LSLBX by Texas Instruments is a PLL frequency synthesizer with 24 terminals, operating at a voltage range of 2.7V to 5.5V. It features a BICMOS technology, nickel/gold terminal finish, and operates in industrial temperature grades (-40°C to 85°C). This chip carrier is suitable for phase-locked loops and frequency synthesis circuits requiring precise frequency control.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 98,085 parts In-Stock

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Netsource Technology, Inc.

USA . 6,867 parts In-Stock

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Vyrian

USA . 5,546 parts In-Stock

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Digiode

USA . 4,916 parts In-Stock

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Bristol Electronics

USA . 2,863 parts In-Stock

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Dan-Mar Components

USA . 2,863 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,500 parts In-Stock

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2,500

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Microfarads

USA . 1,948 parts In-Stock

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Anansix

USA . 1,294 parts In-Stock

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One Stop Electronics

USA . 137 parts In-Stock

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$5.500

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$5.500

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Parana Technologies

USA . 326 parts In-Stock

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$7.432

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$7.920

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326

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DigiPath Technology Company

USA . 2,082 parts In-Stock

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$8.184

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$7.529

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ChromeModa Solutions

Germany . 4,872 parts In-Stock

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$8.351

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$6.848

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IDEA Electronic Components Group

UK . 465 parts In-Stock

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$8.351

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$7.933

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$7.516

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465

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AZTECH Wire

Italy . 288 parts In-Stock

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$13.205

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QUARKTWIN TECHNOLOGY LTD

USA . 16,614 parts In-Stock

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Metaverse IC Inc.

Canada . 12,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,226 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,817 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Perfect Parts

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Corphita

USA . 420 parts In-Stock

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Microchip USA

USA . 323 parts In-Stock

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Overview

Elevate your frequency synthesis circuits with the LMX2336LSLBX by Texas Instruments. Designed with precision and reliability in mind, this PLL frequency synthesizer offers unparalleled performance for a wide range of applications. With a robust package body material and advanced technology, this chip carrier delivers superior quality and durability. Whether you're working in industrial settings or pushing the boundaries of innovation, the LMX2336LSLBX provides the value, benefits, and advantages you need to stay ahead of the curve. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the package body, making it suitable for various industrial applications.

Nominal Supply Voltage (Vsup): 5 V

Operates at a standard 5V supply voltage, making it compatible with common power sources.

Technology: BICMOS

Utilizes BiCMOS technology, combining the benefits of both bipolar and CMOS technologies for efficient and high-performance circuit operation.

Surface Mount: YES

Surface mount design allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures up to 85°C, suitable for industrial environments with varying temperature conditions.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2336LSLBX attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PQCC-N24

JESD-609 Code:

e4

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

DIE OR CHIP

Package Shape:

Package Style (Meter):

CHIP CARRIER, THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

7 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Gold (Ni/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.5 mm

Trade Compliance

LMX2336LSLBX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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