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LMX2336LSLB

Texas Instruments

LMX2336LSLB by Texas Instruments

LMX2336LSLB by Texas Instruments is a PLL frequency synthesizer with 24 terminals, operating at 2.7-5.5V. It features BICMOS technology, -40 to 85°C temp range, and consumes up to 7mA current. Ideal for industrial applications requiring precise frequency synthesis in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,287 parts In-Stock

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7,287

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Digiode

USA . 938 parts In-Stock

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938

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Anansix

USA . 265 parts In-Stock

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265

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Distributors (Availability)

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One Stop Electronics

USA . 252 parts In-Stock

1+ parts

$5.500

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252

$5.500

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AZTECH Wire

Italy . 758 parts In-Stock

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$7.917

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758

$7.917

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Parana Technologies

USA . 711 parts In-Stock

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$16.000

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$16.344

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711

$16.000

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$16.344

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DigiPath Technology Company

USA . 410 parts In-Stock

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$17.618

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410

$17.618

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ChromeModa Solutions

Germany . 5,694 parts In-Stock

1+ parts

$17.978

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$14.742

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5,694

$17.978

$14.742

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IDEA Electronic Components Group

UK . 1,833 parts In-Stock

1+ parts

$17.978

100+ parts

$17.079

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$16.180

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1,833

$17.978

$17.079

$16.180

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Corphita

USA . 4,464 parts In-Stock

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4,464

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Overview

Experience unparalleled performance and reliability with the Texas Instruments LMX2336LSLB PLL Frequency Synthesizer. Designed by a trusted industry leader, this advanced chip carrier offers seamless frequency synthesis for a wide range of applications. With a compact design and high-quality materials, this product ensures optimal functionality in industrial environments. Customers can expect superior value and exceptional benefits, making it the perfect choice for your next project. Elevate your performance with the LMX2336LSLB today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable, the product offers easy installation and saves space on the PCB.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage is common and easily available, making the product compatible with most systems.

No. of Terminals: 24

With 24 terminals, this product offers a wide range of connectivity options and flexibility in circuit design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product's reliability and stable performance in various environmental conditions.

Technology: BICMOS

The use of BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high speed and low power consumption.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2336LSLB attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PQCC-N24

Length:

4.5 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

DIE OR CHIP

Package Shape:

Package Style (Meter):

CHIP CARRIER, THIN PROFILE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

7 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

3.5 mm

Trade Compliance

LMX2336LSLB Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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