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LMX2330LSLDX

Texas Instruments

LMX2330LSLDX by Texas Instruments

LMX2330LSLDX by Texas Instruments is a PLL frequency synthesizer with 20 terminals in a chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial applications. It has a max supply current of 6.6mA and operates on power supplies of 3/5V, making it ideal for various frequency synthesis circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 4,743 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,843 parts In-Stock

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Digiode

USA . 2,757 parts In-Stock

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Anansix

USA . 1,935 parts In-Stock

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One Stop Electronics

USA . 261 parts In-Stock

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$4.500

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Parana Technologies

USA . 661 parts In-Stock

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$10.672

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$11.165

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DigiPath Technology Company

USA . 664 parts In-Stock

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$11.751

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$10.811

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664

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ChromeModa Solutions

Germany . 2,531 parts In-Stock

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$11.991

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$9.833

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IDEA Electronic Components Group

UK . 40 parts In-Stock

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$11.991

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$11.391

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$10.792

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AZTECH Wire

Italy . 586 parts In-Stock

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$17.889

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Lixinc

USA . 16,798 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

USA . 3,843 parts In-Stock

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Corphita

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Overview

Unlock the power of precision frequency synthesis with the LMX2330LSLDX by Texas Instruments. Designed with cutting-edge BICMOS technology, this PLL frequency synthesizer offers unparalleled performance and reliability for industrial-grade applications. The square chip carrier package ensures easy integration into your project, while the low supply current of just 6.6 mA maximizes efficiency. Trust in Texas Instruments' reputation for excellence and experience seamless frequency control with the LMX2330LSLDX. Elevate your designs today with this top-of-the-line solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection to the internal components of the PLL and frequency synthesis circuit, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy installation and integration onto circuit boards, saving time and effort in the assembly process.

Package Shape: SQUARE

Square package shape provides a compact and uniform design, optimizing space efficiency within the overall system layout.

Power Supplies (V): 3/5

Ability to operate on multiple power supply voltages (3V and 5V) offers flexibility in compatibility with different system requirements.

No. of Terminals: 20

A higher number of terminals allow for more connections and functionalities, enabling a versatile range of applications for the PLL and frequency synthesis circuit.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers a robust and secure housing for the integrated circuit, ensuring reliable performance under varying operating conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the PLL and frequency synthesis circuit can withstand elevated heat levels in industrial environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C allows the PLL and frequency synthesis circuit to function optimally even in cold temperature conditions.

Terminal Position: QUAD

Quad terminal position enables easy connections and improved signal integrity, enhancing the overall performance of the PLL and frequency synthesis circuit.

Other IC type: PLL FREQUENCY SYNTHESIZER

Inclusion of PLL frequency synthesizer as another integrated circuit type enhances frequency stability and accuracy in signal generation and synchronization.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certification ensures reliable operation of the PLL and frequency synthesis circuit in harsh industrial environments with varying temperature conditions.

Maximum Supply Current (Isup): 6.6 mA

Low maximum supply current of 6.6 mA results in efficient power consumption, contributing to energy savings and prolonged battery life in portable devices.

Technology: BICMOS

Employing BICMOS technology provides a balance between bipolar and CMOS characteristics, offering high-speed performance and low power consumption in the PLL and frequency synthesis circuit.

Terminal Form: NO LEAD

No-lead terminal form enhances solder joint reliability and ensures secure connections, reducing the risk of electrical failures or intermittencies.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm facilitates close spacing of terminals, enabling miniaturization and compact design of the PLL and frequency synthesis circuit.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2330LSLDX attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N20

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.14SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

6.6 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LMX2330LSLDX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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