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LMX2316TM

Texas Instruments

LMX2316TM by Texas Instruments

LMX2316TM by Texas Instruments is a PLL frequency synthesizer with 16 terminals, operating voltage range of 2.3V to 5.5V, and temperature range of -40°C to 85°C. It features BICMOS technology, small outline package style, and gull wing terminal form. Ideal for applications requiring precise frequency synthesis in industrial environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

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Digiode

USA . 3,719 parts In-Stock

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Anansix

USA . 1,755 parts In-Stock

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Vyrian

USA . 1,373 parts In-Stock

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Semi Source

USA . 191 parts In-Stock

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LWI Electronics Inc

India . 94 parts In-Stock

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PC Components Company LLC

USA . 35 parts In-Stock

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Avant Electronics Limited

UK . 24 parts In-Stock

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Inventory MP

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Bristol Electronics

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Prism Electronics

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One Stop Electronics

USA . 820 parts In-Stock

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$2.500

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820

$2.500

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Ampacity Inc.

Singapore . 1,473 parts In-Stock

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$3.500

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$3.500

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AZTECH Wire

Italy . 700 parts In-Stock

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$8.115

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Parana Technologies

USA . 671 parts In-Stock

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$21.463

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$21.839

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671

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DigiPath Technology Company

USA . 1,365 parts In-Stock

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$23.634

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$21.743

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ChromeModa Solutions

Germany . 6,224 parts In-Stock

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$24.116

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$19.775

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$24.116

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IDEA Electronic Components Group

UK . 882 parts In-Stock

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$24.116

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$22.910

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$21.704

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882

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Component Stockers USA

USA . 268 parts In-Stock

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$99.990

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Kepictronics

USA . 7,540 parts In-Stock

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Corphita

USA . 1,764 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Overview

Enhance your electronic projects with the high-quality LMX2316TM PLL frequency synthesizer from Texas Instruments. Designed with precision and reliability in mind, this advanced circuit offers unparalleled performance and versatility for a wide range of applications. From telecommunications to consumer electronics, the LMX2316TM provides exceptional value by delivering stable and accurate frequency synthesis in a compact and durable package. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations every time. Elevate your designs with the LMX2316TM and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3 V

The 3V supply voltage requirement is commonly available and stable, making it compatible with a wide range of applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85C, this product is suitable for use in various industrial environments without overheating.

Technology: BICMOS

The BICMOS technology provides a combination of bipolar and CMOS characteristics, offering high speed and low power consumption for efficient operation.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2316TM attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LMX2316TM Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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