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LMV1012UPX-07

Texas Instruments

LMV1012UPX-07 by Texas Instruments

LMV1012UPX-07 by Texas Instruments is an audio preamplifier with 0.1% harmonic distortion, gain of 7.8 dB, and a nominal bandwidth of 95 kHz. It operates in industrial temperature grade range from -40 to 85°C, suitable for audio and video amplification applications requiring precise signal processing in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,991 parts In-Stock

1+ parts

-

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6,991

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Digiode

USA . 4,902 parts In-Stock

1+ parts

-

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4,902

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Anansix

USA . 477 parts In-Stock

1+ parts

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477

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 988 parts In-Stock

1+ parts

$2.579

100+ parts

-

1k+ parts

$3.071

10k+ parts

-

988

$2.579

-

$3.071

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DigiPath Technology Company

USA . 1,574 parts In-Stock

1+ parts

$2.840

100+ parts

-

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10k+ parts

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1,574

$2.840

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ChromeModa Solutions

Germany . 4,464 parts In-Stock

1+ parts

$2.898

100+ parts

$2.376

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-

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4,464

$2.898

$2.376

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IDEA Electronic Components Group

UK . 640 parts In-Stock

1+ parts

$2.898

100+ parts

-

1k+ parts

$2.608

10k+ parts

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640

$2.898

-

$2.608

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AZTECH Wire

Italy . 386 parts In-Stock

1+ parts

$10.366

100+ parts

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386

$10.366

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One Stop Electronics

USA . 1,575 parts In-Stock

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$18.800

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1,575

$18.800

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Corphita

USA . 1,246 parts In-Stock

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1,246

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Overview

Enhance your audio experience with the LMV1012UPX-07 by Texas Instruments. Crafted with precision and expertise, this audio preamplifier offers unparalleled quality and reliability. Perfect for a wide range of applications in the audio and video industry, this amplifier delivers clear, crisp sound with minimal distortion. With its compact design and advanced technology, the LMV1012UPX-07 provides exceptional value and performance, making it the perfect choice for all your audio amplification needs. Elevate your audio game today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides a lightweight and durable package for the amplifier, making it easy to handle and resistant to damage.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration of the amplifier onto circuit boards, saving space and simplifying assembly.

General IC Type: AUDIO PREAMPLIFIER

Designed specifically for audio preamplification, ensuring high-quality sound amplification and fidelity in audio applications.

Harmonic Distortion: 0.1%

Very low harmonic distortion results in clear and accurate audio reproduction without distortion or interference.

No. of Terminals: 4

Four terminals provide easy connectivity and flexibility for various input and output configurations in audio systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in challenging environmental conditions.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage requirement allows for operation in low-power applications, increasing energy efficiency.

Nominal Bandwidth: 95 kHz

Wide nominal bandwidth allows for the amplification of a wide range of audio frequencies, ensuring versatile and high-performance audio amplification.

Gain: 7.8 dB

High gain value amplifies audio signals effectively, enhancing the overall audio output and clarity.

Maximum Supply Voltage (Vsup): 5 V

Safe maximum supply voltage rating ensures the amplifier remains protected from overvoltage conditions, increasing longevity and reliability.

Technical Specifications

Audio & Video Amplifiers LMV1012UPX-07 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

95 kHz

General IC Type:

Gain:

7.8 dB

Harmonic Distortion:

.1 %

JESD-30 Code:

R-PBGA-B4

Length:

1.006 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

.93 mm

Trade Compliance

LMV1012UPX-07 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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