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LMR10515XSDX/NOPB

Texas Instruments

LMR10515XSDX/NOPB by Texas Instruments

LMR10515XSDX/NOPB by Texas Instruments is a switching regulator with 1.5A output current, PWM control mode, and 3000 kHz max switching frequency. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and compact square package design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,164 parts In-Stock

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3,164

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Digiode

USA . 2,022 parts In-Stock

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2,022

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Distributors (Availability)

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Ampacity Inc.

Singapore . 910 parts In-Stock

1+ parts

$1.500

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910

$1.500

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Microchip USA

USA . 6,350 parts In-Stock

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$3.506

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6,350

$3.506

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Parana Technologies

USA . 1,055 parts In-Stock

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$4.006

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$4.471

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1,055

$4.006

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$4.471

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IDEA Electronic Components Group

UK . 774 parts In-Stock

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$4.501

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$4.051

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774

$4.501

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$4.051

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ChromeModa Solutions

Germany . 644 parts In-Stock

1+ parts

$4.501

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$3.691

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644

$4.501

$3.691

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One Stop Electronics

USA . 623 parts In-Stock

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$5.500

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623

$5.500

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Semicontronic

India . 1,214 parts In-Stock

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$7.500

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$7.312

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$7.275

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1,214

$7.500

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$7.275

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AZTECH Wire

Italy . 707 parts In-Stock

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$18.911

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707

$18.911

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Corphita

USA . 1,425 parts In-Stock

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DigiPath Technology Company

USA . 975 parts In-Stock

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$4.058

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975

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$4.058

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Corohmni

South Africa . 465 parts In-Stock

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A-Z Elektronik GmbH

Germany . 325 parts In-Stock

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Overview

Discover the power of innovation with Texas Instruments' LMR10515XSDX/NOPB switching regulator. Designed for high-performance applications, this compact device offers unparalleled efficiency and reliability. From automotive to industrial settings, this cutting-edge technology provides a seamless solution for your power management needs. Experience the difference with Texas Instruments – where quality meets value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and convenient installation on PCBs.

Package Shape: SQUARE

Compact design for efficient use of space on the circuit board.

Maximum Operating Temperature: 125 °C

Can operate reliably in high temperature environments.

Minimum Output Voltage: 0.6 V

Provides flexibility in output voltage requirements.

Control Mode: CURRENT-MODE

Efficient control of output current for optimal performance.

Minimum Operating Temperature: -40 °C

Can operate in extreme low temperature conditions.

Terminal Finish: Matte Tin (Sn)

Prevents corrosion and ensures good electrical conductivity.

Maximum Output Voltage: 4.5 V

Suitable for applications requiring higher output voltage levels.

Nominal Input Voltage: 5 V

Compatible with 5V input sources commonly found in electronics.

Maximum Output Current: 1.5 A

Capable of providing high output current for demanding applications.

Technical Specifications

Switching Regulators & Controllers LMR10515XSDX/NOPB attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES IN ADJUSTABLE MODE FROM 0.6 TO 4.5V

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

3 V

Nominal Input Voltage:

5 V

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.5 A

Maximum Output Voltage:

4.5 V

Minimum Output Voltage:

.6 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

3000 kHz

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

NO LEAD

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

LMR10515XSDX/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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