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LMP8602MM

Texas Instruments

LMP8602MM by Texas Instruments

LMP8602MM by Texas Instruments is an instrumentation amplifier with a max input offset voltage of 1000uV and a nominal voltage of 3.3V. With a min common mode reject ratio of 90dB, it is ideal for automotive applications requiring precise signal amplification in compact spaces. The package style is small outline, thin profile, shrink pitch, making it suitable for surface mount designs with limited space constraints.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,956 parts In-Stock

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Anansix

USA . 1,629 parts In-Stock

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Digiode

USA . 920 parts In-Stock

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920

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Nova Conductors

Japan . 300 parts In-Stock

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Corohmni

South Africa . 1,089 parts In-Stock

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$1.133

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One Stop Electronics

USA . 1,126 parts In-Stock

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$3.410

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Aztec Data Supply Inc.

USA . 2,706 parts In-Stock

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$4.610

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$4.610

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Ampacity Inc.

Singapore . 1,019 parts In-Stock

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$5.410

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Parana Technologies

USA . 2,033 parts In-Stock

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$5.820

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$6.609

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DigiPath Technology Company

USA . 548 parts In-Stock

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$6.408

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$5.896

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ChromeModa Solutions

Germany . 3,328 parts In-Stock

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$6.539

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IDEA Electronic Components Group

UK . 2,338 parts In-Stock

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$6.539

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$5.885

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Semicontronic

India . 467 parts In-Stock

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$7.410

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$7.225

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$7.188

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467

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AZTECH Wire

Italy . 431 parts In-Stock

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Corphita

USA . 4,614 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Enhance your instrumentation systems with the LMP8602MM by Texas Instruments. With a reputation for quality and reliability, Texas Instruments delivers advanced technology in a compact package. Ideal for automotive applications, this instrumentation amplifier offers precision and performance that exceeds expectations. Experience the value of enhanced signal processing, improved accuracy, and increased efficiency with the LMP8602MM. Elevate your projects with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for a variety of applications.

Maximum Input Offset Voltage: 1000 uV

Low input offset voltage ensures accurate and precise measurements.

Maximum Average Bias Current (IIB): 0.02 uA

Low bias current minimizes errors in the output signal.

Surface Mount: YES

Easy to mount on PCBs, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard supply voltage, compatible with many systems.

No. of Terminals: 8

Sufficient terminals for connecting to external components and circuits.

Maximum Supply Voltage Limit: 6 V

Wide supply voltage range for flexibility in different applications.

Maximum Operating Temperature: 125 °C

High temperature tolerance ensures reliable operation in challenging environments.

Minimum Voltage Gain: 49.75

Provides high sensitivity for small input signals.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions without performance degradation.

Terminal Finish: TIN LEAD

Provides corrosion resistance and good solderability.

Maximum Seated Height: 1.09 mm

Low profile design for compact and space-constrained applications.

Nominal Bandwidth (3dB): 0.06 MHz

Wide bandwidth for accurate signal processing.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand peak reflow temperatures without damage.

Peak Reflow Temperature °C: 260

High temperature resistance for reliable soldering process.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications with high temperature requirements.

Minimum Common Mode Reject Ratio: 90 dB

High rejection of common mode signals for accurate measurements.

Terminal Form: GULL WING

Easy to solder and provides mechanical strength.

Amplifier Type: INSTRUMENTATION AMPLIFIER

Specifically designed for accurate measurement of small signals with high common mode rejection.

Nominal Slow Rate: 0.83 V/us

Stable and controlled output for gradual changes in input.

Nominal Voltage Gain: 50

Provides consistent amplification of input signals.

Technical Specifications

Instrumentation Amplifiers LMP8602MM attributes and parameters. Explore more Instrumentation Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Instrumentation Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

60 kHz

Nominal Slew Rate:

0.83 V/us

Minimum Common Mode Rejection Ratio (CMRR ):

90 dB

Input Offset Voltage Limit:

1 mV

Peak Bias Current:

20 nA

Minimum Voltage Gain:

49.75

Nominal Voltage Gain:

50

Maximum Voltage Gain:

50.25

Operational Characteristics

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Reflow Peak Time Limit:

40 s

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.09 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin Lead

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Trade Compliance

LMP8602MM Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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