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LMP8602MME/NOPB

Texas Instruments

LMP8602MME/NOPB by Texas Instruments

LMP8602MME/NOPB by Texas Instruments is an instrumentation amplifier with 2000uV max input offset voltage, 60kHz unity gain bandwidth, and 90dB min CMRR. Ideal for automotive applications due to its -40 to 125 °C operating temp range and 3.3/5V power supplies. Package style: small outline, thin profile, shrink pitch.

Median Price

$4.128

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 36,480 parts In-Stock

1+ parts

$3.487

100+ parts

$3.055

1k+ parts

$1.726

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-

36,480

$3.487

$3.055

$1.726

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Mouser Electronics

USA . 5,466 parts In-Stock

1+ parts

$4.770

100+ parts

$3.030

1k+ parts

$2.660

10k+ parts

$2.630

5,466

$4.770

$3.030

$2.660

$2.630

DigiKey

USA . 153 parts In-Stock

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153

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Nova Conductors

Japan . 10 parts In-Stock

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$3.037

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-

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10

$3.037

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Digiode

USA . 936 parts In-Stock

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$3.313

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936

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Vyrian

USA . 15,591 parts In-Stock

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15,591

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Chip Stock

USA . 8,600 parts In-Stock

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Anansix

USA . 1,941 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 15,539 parts In-Stock

1+ parts

$2.960

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15,539

$2.960

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Semicontronic

India . 15,425 parts In-Stock

1+ parts

$2.960

100+ parts

$2.886

1k+ parts

$2.871

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15,425

$2.960

$2.886

$2.871

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Argo Parts USA

USA . 4,460 parts In-Stock

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$3.037

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Continental Prestige Electronics

USA . 787 parts In-Stock

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$3.037

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$2.976

787

$3.037

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$2.976

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$3.098

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$3.098

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$3.098

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2,000

$3.098

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Corphita

USA . 4,796 parts In-Stock

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$3.138

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4,796

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Corohmni

South Africa . 261 parts In-Stock

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$4.455

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Parana Technologies

USA . 725 parts In-Stock

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$5.135

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$5.727

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725

$5.135

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$5.727

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DigiPath Technology Company

USA . 478 parts In-Stock

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$5.655

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$5.202

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478

$5.655

$5.202

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ChromeModa Solutions

Germany . 6,407 parts In-Stock

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$5.770

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$4.731

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6,407

$5.770

$4.731

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IDEA Electronic Components Group

UK . 632 parts In-Stock

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$5.770

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$5.193

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632

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Lixinc

USA . 17,659 parts In-Stock

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Perfect Parts

USA . 16,947 parts In-Stock

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iodParts Technologies Inc.

India . 8,025 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$2.976

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$2.885

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$2.824

100

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$2.976

$2.885

$2.824

Overview

Elevate your instrumentation amplifier experience with the LMP8602MME/NOPB from Texas Instruments. Designed with precision and quality in mind, this small outline, thin profile amplifier offers unparalleled performance in a wide range of applications. Whether you're in the automotive industry or working on sensitive electronic equipment, this amplifier delivers reliable results with minimal power consumption. Upgrade your systems today and unlock the full potential of your projects with the LMP8602MME/NOPB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the internal components of the instrumentation amplifier.

Maximum Input Offset Voltage: 2000 uV

Low input offset voltage ensures accurate and precise amplification of signals.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, ideal for compact and space-saving designs.

Package Shape: RECTANGULAR

The rectangular shape provides a versatile and convenient form factor for various applications.

Power Supplies (V): 3.3/5

Compatible with common power supply voltages, making it easy to integrate into existing systems.

No. of Terminals: 8

Sufficient number of terminals for connections, offering flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This style optimizes space usage and enhances the overall compactness of the product.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for industrial and automotive environments.

Maximum Common Mode Voltage: 60 V

Handles a wide range of common mode voltages, ensuring reliable performance in diverse conditions.

Minimum Operating Temperature: -40 °C

Capable of operating in low temperatures, suitable for outdoor or harsh environments.

Terminal Finish: MATTE TIN

Provides a reliable and stable terminal finish for consistent conductivity.

Terminal Position: DUAL

Dual terminal positions offer versatility in installation and connectivity options.

Maximum Seated Height: 1.07 mm

Low profile design allows for compact installation in space-constrained applications.

Width: 3 mm

Compact width enables integration into tight spaces and smaller electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures a safe and efficient reflow process during manufacturing.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures, essential for the assembly process.

Length: 3 mm

Compact length for a space-efficient design, suitable for portable or compact applications.

Temperature Grade: AUTOMOTIVE

Automotive-grade quality ensures reliability and robust performance in automotive applications.

Nominal Unity Gain Bandwidth: 60 kHz

Provides a wide bandwidth for high-speed signal amplification, suitable for various applications.

Minimum Common Mode Reject Ratio: 90 dB

High common mode rejection ratio reduces interference and noise in the amplified signal.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering onto circuit boards for a secure connection.

Amplifier Type: INSTRUMENTATION AMPLIFIER

Specifically designed for precise and accurate signal amplification in instrumentation applications.

Maximum Supply Current: 1.5 mA

Low power consumption for energy-efficient operation.

Packing Method: TR

Tape and reel packing method for convenient handling and automated assembly processes.

Nominal Slow Rate: 0.4 V/us

Provides a steady and controlled output voltage rise, suitable for gradual signal amplification.

Terminal Pitch: 0.65 mm

Narrow terminal pitch for compact layout and efficient use of circuit board space.

Nominal Voltage Gain: 50

Standard voltage gain setting for amplifying signals to the desired level.

Technical Specifications

Instrumentation Amplifiers LMP8602MME/NOPB attributes and parameters. Explore more Instrumentation Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Power Supply:

3.3/5 V

Total Functions:

1

Sub-Category:

Instrumentation Amplifiers

Performance Specifications

Nominal Unity Gain Bandwidth:

60 kHz

Nominal Slew Rate:

0.4 V/us

Minimum Common Mode Rejection Ratio (CMRR ):

90 dB

Input Offset Voltage Limit:

2 mV

Maximum Supply Current:

1.5 mA

Maximum Common Mode Voltage:

60 V

Nominal Voltage Gain:

50

Operational Characteristics

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Reflow Peak Time Limit:

30 s

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.042 in (1.07 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.19

Trade Compliance

LMP8602MME/NOPB Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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