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LMP7701MF/NOPB

Texas Instruments

LMP7701MF/NOPB by Texas Instruments

LMP7701MF/NOPB by Texas Instruments is a CMOS Operational Amplifier with low-offset and low-bias features. It has a max input offset voltage of 500 uV, nominal unity gain bandwidth of 2500 kHz, and operates at temperatures ranging from -40 to 125 °C. Ideal for automotive applications due to its small outline package style and high common mode reject ratio of 138 dB.

Median Price

$3.746

Lifecycle Status

Suppliers In-Stock

29

In-Stock Inventory

1k+

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Chip1Stop

Japan . 749 parts In-Stock

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$3.560

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$1.730

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$1.640

749

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Arrow

USA . 998 parts In-Stock

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$3.746

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$2.362

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Element14

Singapore . 399 parts In-Stock

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DigiKey

USA . 6,608 parts In-Stock

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Mouser Electronics

USA . 2,580 parts In-Stock

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RS (Exports)

UK . 2,555 parts In-Stock

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Verical

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Digiode

USA . 3,621 parts In-Stock

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Bristol Electronics

USA . 1,205 parts In-Stock

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TME

Poland . 891 parts In-Stock

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Nova Conductors

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Chip Stock

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Vyrian

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ComSIT Distribution GmbH

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ComSIT USA

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Sensible Micro Corp

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Anansix

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Microfarads

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Avant Electronics Limited

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Semtec, LLC

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Rebound Electronics

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Holdelec - ElecDif-Pro

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LIBRA Elektronik GmbH

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Semicontronic

India . 9,440 parts In-Stock

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$1.560

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$1.521

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$1.513

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Parana Technologies

USA . 522 parts In-Stock

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$1.758

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Continental Prestige Electronics

USA . 4,766 parts In-Stock

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$1.870

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$1.480

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ChromeModa Solutions

Germany . 958 parts In-Stock

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IDEA Electronic Components Group

UK . 277 parts In-Stock

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Corphita

USA . 3,650 parts In-Stock

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Ampacity Inc.

Singapore . 3,423 parts In-Stock

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Argo Parts USA

USA . 4,111 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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Advanced Electronics

New Zealand . 1,050 parts In-Stock

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$4.891

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Corohmni

South Africa . 1,879 parts In-Stock

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Perfect Parts

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Futuretech Components

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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Infinite Electronics LLP (Excess)

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Formix International (Excess)

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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DigiPath Technology Company

USA . 1,593 parts In-Stock

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$1.781

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Kepictronics

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Lucentia Tech

USA . 1,000 parts In-Stock

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$0.162

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XScomponents

USA . 800 parts In-Stock

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Robosynatics

Brazil . 500 parts In-Stock

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$0.162

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$0.162

Speed Components Ltd (Excess)

Israel . 91 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the LMP7701MF/NOPB operational amplifier by Texas Instruments. With a wide range of applications in various industries, this high-quality product offers customers exceptional value through its low-offset, low-bias, and high common mode rejection ratio features. Trust in Texas Instruments, a leading manufacturer known for delivering cutting-edge technology, to provide you with a compact, efficient, and reliable solution for all your operational amplifier needs. Elevate your projects and achieve superior results with the LMP7701MF/NOPB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for various applications.

Maximum Input Offset Voltage: 500 uV

With a low input offset voltage, this op amp provides accurate amplification of signals, making it suitable for precision applications.

Maximum Average Bias Current (IIB): 0.0004 uA

The low average bias current minimizes power consumption, making this op amp energy-efficient and ideal for battery-powered devices.

Surface Mount: YES

Being surface mountable, this op amp is easy to integrate into compact circuit designs, saving space and simplifying assembly.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy PCB layout and placement, enhancing design flexibility and ease of use.

Nominal Common Mode Reject Ratio: 138 dB

With a high common mode rejection ratio, this op amp effectively rejects noise and interference, ensuring clean and reliable signal amplification.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this op amp is compatible with a wide range of power sources and ideal for various applications.

Power Supplies (V): 3/5/+-5

With multiple power supply options, this op amp offers flexibility in voltage requirements, making it versatile and suitable for various operating conditions.

No. of Terminals: 5

The five terminals provide multiple connection points for input and output signals, allowing for versatile circuit configurations and integration.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline, low profile, and shrink pitch package style saves space on the PCB, enabling compact and efficient circuit designs.

Technical Specifications

Operational Amplifiers (Op Amps) LMP7701MF/NOPB attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

3/5/±5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

Yes

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

2.5 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

138 dB

Minimum Common Mode Rejection Ratio (CMRR ):

92 dB

Input Offset Voltage Limit:

500 uV

Minimum Voltage Gain:

63100

Nominal Slew Rate:

1.1 V/us

Peak Bias Current:

400 pA

Maximum Bias Current (IIB) @25 °C:

1 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6.6 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-6.6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

1.1 mA

Physical Characteristics

Length:

0.115 in (2.92 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.048 in (1.22 mm)

Total Terminals:

5

Terminal Pitch:

0.038 in (0.953 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

LMP7701MF/NOPB Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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