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LMP7702MMX/NOPB

Texas Instruments

LMP7702MMX/NOPB by Texas Instruments

LMP7702MMX/NOPB by Texas Instruments is a dual operational amplifier with low-offset and low-bias features. It operates at a max supply voltage of 6.6V, has a nominal unity gain bandwidth of 2500 kHz, and offers high common mode rejection ratio for automotive applications. The package style is small outline with thin profile, making it suitable for surface mount designs in various electronic systems.

Median Price

$2.286

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 36,736 parts In-Stock

1+ parts

$2.889

100+ parts

$2.531

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$1.430

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36,736

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$1.430

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Chip1Stop

Japan . 17,500 parts In-Stock

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$1.740

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$1.740

DigiKey

USA . 6,473 parts In-Stock

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$2.286

6,473

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$2.286

Distributors (In-Stock)

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Nova Conductors

Japan . 91 parts In-Stock

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$2.147

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Digiode

USA . 4,775 parts In-Stock

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$2.745

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Vyrian

USA . 15,953 parts In-Stock

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Chip Stock

USA . 7,970 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

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Anansix

USA . 734 parts In-Stock

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Corohmni

South Africa . 1,058 parts In-Stock

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$1.085

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$1.085

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Parana Technologies

USA . 637 parts In-Stock

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$1.385

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$2.098

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Semicontronic

India . 30,829 parts In-Stock

1+ parts

$1.480

100+ parts

$1.443

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$1.436

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30,829

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$1.436

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Ampacity Inc.

Singapore . 16,108 parts In-Stock

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$1.480

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DigiPath Technology Company

USA . 781 parts In-Stock

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$1.525

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ChromeModa Solutions

Germany . 2,055 parts In-Stock

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$1.556

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$1.276

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IDEA Electronic Components Group

UK . 1,967 parts In-Stock

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$1.556

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$1.400

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Aranea Global

USA . 500 parts In-Stock

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$2.104

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$2.019

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Continental Prestige Electronics

USA . 6,388 parts In-Stock

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$2.147

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$2.104

6,388

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Argo Parts USA

USA . 2,286 parts In-Stock

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Corphita

USA . 3,166 parts In-Stock

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Component Stockers USA

USA . 16,444 parts In-Stock

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$3.760

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$2.770

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$1.990

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Advanced Electronics

New Zealand . 6,000 parts In-Stock

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$4.594

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$4.364

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Perfect Parts

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Alle Elektronik GmbH

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Authorized Procurement Solutions

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Futuretech Components

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Lixinc

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Overview

Experience high-quality performance and precision with the LMP7702MMX/NOPB operational amplifiers from Texas Instruments. Designed with cutting-edge technology, this product offers exceptional value and benefits for a wide range of applications. Whether you're working on automotive systems, industrial equipment, or consumer electronics, these op amps deliver reliable operation and superior functionality. Trust in Texas Instruments' reputation for excellence and choose the LMP7702MMX/NOPB for all your operational amplifier needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and long-lasting.

Maximum Input Offset Voltage: 520 uV

Low input offset voltage ensures accurate and precise amplification of signals without introducing significant errors.

Maximum Average Bias Current (IIB): 0.0004 uA

Low bias current reduces power consumption and minimizes signal distortion, ensuring high performance.

Surface Mount: YES

Surface mount design allows for easy integration onto PCBs, saving space and simplifying assembly.

Nominal Common Mode Reject Ratio: 138 dB

High common mode rejection ratio helps in rejecting noise and interference from the input signal, resulting in clean output.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage, making it compatible with a wide range of applications.

Frequency Compensation: YES

Frequency compensation ensures stability and reliable performance over a range of operating conditions.

Technology: BIPOLAR

Bipolar technology offers high precision and low noise, making it suitable for demanding applications where accuracy is crucial.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are versatile and widely used in various circuits for amplification, filtering, and signal conditioning.

Technical Specifications

Operational Amplifiers (Op Amps) LMP7702MMX/NOPB attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

3/5/±5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

Yes

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

2.5 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

138 dB

Minimum Common Mode Rejection Ratio (CMRR ):

92 dB

Input Offset Voltage Limit:

520 uV

Minimum Voltage Gain:

50100

Nominal Slew Rate:

1.1 V/us

Peak Bias Current:

400 pA

Maximum Bias Current (IIB) @25 °C:

1 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6.6 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-6.6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

2.1 mA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.19

Trade Compliance

LMP7702MMX/NOPB Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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