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LMK04821NKDR

Texas Instruments

LMK04821NKDR by Texas Instruments

LMK04821NKDR by Texas Instruments is a clock generator with a max output frequency of 500 MHz. It operates in industrial temperature range (-40 to 85 °C) and has a supply voltage of 3.15-3.45 V. Suitable for applications requiring precise timing control, it features a compact square package with 64 terminals for surface mount assembly.

Median Price

$16.361

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 98,553 parts In-Stock

1+ parts

$16.361

100+ parts

$14.291

1k+ parts

$9.856

10k+ parts

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98,553

$16.361

$14.291

$9.856

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,861 parts In-Stock

1+ parts

$15.543

100+ parts

-

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4,861

$15.543

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Vyrian

USA . 3,411 parts In-Stock

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-

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3,411

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Distributors (Availability)

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AZTECH Wire

Italy . 233 parts In-Stock

1+ parts

$8.570

100+ parts

-

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233

$8.570

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Corohmni

South Africa . 836 parts In-Stock

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$12.813

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836

$12.813

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Parana Technologies

USA . 911 parts In-Stock

1+ parts

$13.544

100+ parts

-

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$14.047

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911

$13.544

-

$14.047

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Corphita

USA . 1,136 parts In-Stock

1+ parts

$14.725

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1,136

$14.725

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DigiPath Technology Company

USA . 1,550 parts In-Stock

1+ parts

$14.914

100+ parts

$13.721

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1,550

$14.914

$13.721

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IDEA Electronic Components Group

UK . 2,216 parts In-Stock

1+ parts

$15.218

100+ parts

$14.457

1k+ parts

$13.696

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-

2,216

$15.218

$14.457

$13.696

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ChromeModa Solutions

Germany . 711 parts In-Stock

1+ parts

$15.218

100+ parts

$12.479

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-

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711

$15.218

$12.479

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Futuretech Components

Singapore . 371 parts In-Stock

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371

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Kepictronics

USA . 308 parts In-Stock

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Overview

Experience top-notch clock generation with the LMK04821NKDR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees quality and reliability. This clock generator is perfect for a wide range of applications, offering a maximum output clock frequency of 500 MHz. With a sleek square package shape and compact design, this product is surface mountable, making it easy to integrate into your projects. Trust in Texas Instruments to deliver cutting-edge technology that provides exceptional value and performance to meet your needs.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure placement on PCBs, saving space and simplifying assembly process.

Maximum Supply Voltage: 3.45 V

Can handle high supply voltage levels, providing a wide range of compatibility with different systems.

Package Shape: SQUARE

Square shape is typically more compact and efficient for space-constrained applications.

Maximum Output Clock Frequency: 500 MHz

High clock frequency allows for fast data processing and communication within the system.

No. of Terminals: 64

Sufficient number of terminals for connecting to various components and peripherals in the system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Variety of package styles offer flexibility in design and heat dissipation options for optimal performance.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable operation in harsh environments or extreme conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient and reliable operation.

Nominal Supply Voltage: 3.3 V

Compatible with standard supply voltage levels, making integration easier with existing systems.

Technical Specifications

Clock Generators LMK04821NKDR attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

500 MHz

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Nominal Primary Clock/Crystal Frequency:

40 MHz

Maximum Seated Height:

.8 mm

Maximum Supply Current:

665 mA

Maximum Supply Voltage:

3.45 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Trade Compliance

LMK04821NKDR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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