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LMK04808BEVAL/NOPB

Texas Instruments

LMK04808BEVAL/NOPB by Texas Instruments

LMK04808BEVAL/NOPB by Texas Instruments is a PLLatinum™ series Timing Evaluation Board with Clock Conditioner function. It features a 122.88MHz VCXO, integrated PLL and VCO, and comes with board(s) and cable(s). Ideal for evaluating the LMK04808 IC in applications requiring precise clock conditioning.

Median Price

$328.900

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6 parts In-Stock

1+ parts

$299.000

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$299.000

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DigiKey

USA . 2 parts In-Stock

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$358.800

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$358.800

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Distributors (In-Stock)

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Digiode

USA . 4,142 parts In-Stock

1+ parts

$284.050

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4,142

$284.050

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Vyrian

USA . 3,937 parts In-Stock

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3,937

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Distributors (Availability)

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Ampacity Inc.

Singapore . 5 parts In-Stock

1+ parts

$254.150

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5

$254.150

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Semicontronic

India . 4 parts In-Stock

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$254.150

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$247.796

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$246.526

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4

$254.150

$247.796

$246.526

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Corphita

USA . 194 parts In-Stock

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$269.100

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$269.100

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Corohmni

South Africa . 334 parts In-Stock

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$299.000

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334

$299.000

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Component Stockers USA

USA . 2 parts In-Stock

1+ parts

$353.390

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2

$353.390

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Parana Technologies

USA . 1,491 parts In-Stock

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$1.334

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1,491

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$1.334

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DigiPath Technology Company

USA . 1,118 parts In-Stock

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IDEA Electronic Components Group

UK . 1,110 parts In-Stock

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ChromeModa Solutions

Germany . 990 parts In-Stock

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990

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Perfect Parts

USA . 1 parts In-Stock

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Overview

Unlock the power of precision timing with the LMK04808BEVAL/NOPB evaluation kit from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability in their products. The LMK04808BEVAL/NOPB is perfect for applications in development boards, kits, and programmers, offering an integrated PLL and VCO for seamless clock conditioning. With a 122.88MHz VCXO and supplied contents including board(s) and cable(s), this timing solution provides exceptional value and performance for all your design needs. Experience the benefits of Texas Instruments' cutting-edge technology with the LMK04808BEVAL/NOPB.

Feature Benefit Bullets

Series: PLLatinum™

Indicates high quality and performance as part of the PLLatinum™ series.

Type: Timing

Specifically designed for clock conditioning purposes, ensuring accurate and reliable timing signals.

Function: Clock Conditioner

Essential for maintaining signal integrity and stability in clock distribution systems.

Primary Attributes: 122.88MHz VCXO

Features a high-frequency VCXO for precision clock generation and synchronization.

Supplied Contents: Board(s), Cable(s)

Includes all necessary components for easy setup and evaluation of the LMK04808.

Secondary Attributes: Integrated PLL and VCO

Combines PLL and VCO functionalities in a single device, reducing the need for additional components.

Base Product Number: LMK04808

Directly corresponds to the specific IC/part used in the evaluation board, ensuring compatibility.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Can be stored and handled in various environmental conditions without risk of moisture damage.

Technical Specifications

Additional Parts LMK04808BEVAL/NOPB attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-35154
LMK04808BEVALNOPB
LMK04808BEVAL/NOPB-ND

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Standard Package:

1

Series:

PLLatinum™

Function:

Clock Conditioner

Type:

Timing

Supplied Contents:

Board(s), Cable(s)

Secondary Attributes:

Integrated PLL and VCO

Utilized IC / Part:

LMK04808

Package:

Box

Embedded:

No

Primary Attributes:

122.88MHz VCXO

Base Product Number:

LMK04808

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

LMK04808BEVAL/NOPB Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8543.70.9860

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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