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LMK03806BEVAL/NOPB

Texas Instruments

LMK03806BEVAL/NOPB by Texas Instruments

LMK03806BEVAL/NOPB by Texas Instruments is a Timing Clock Generator with 14 programmable LVCMOS, LVDS or LVPECL outputs. It is an Evaluation Board used for demonstrating ultra low jitter performance. The package includes board(s) and cable(s), making it ideal for testing the LMK03806 IC in various applications.

Median Price

$328.900

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Texas Instruments

USA . 18 parts In-Stock

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$299.000

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DigiKey

USA . 5 parts In-Stock

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$358.800

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Digiode

USA . 2,995 parts In-Stock

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$284.050

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Vyrian

USA . 6,091 parts In-Stock

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Semicontronic

India . 10 parts In-Stock

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$254.150

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$247.796

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$246.526

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10

$254.150

$247.796

$246.526

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Corphita

USA . 4,088 parts In-Stock

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$269.100

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Corohmni

South Africa . 105 parts In-Stock

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$299.000

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Ampacity Inc.

Singapore . 10 parts In-Stock

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$553.150

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10

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ChromeModa Solutions

Germany . 4,074 parts In-Stock

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IDEA Electronic Components Group

UK . 2,373 parts In-Stock

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DigiPath Technology Company

USA . 1,151 parts In-Stock

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Parana Technologies

USA . 927 parts In-Stock

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$0.553

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Overview

Elevate your projects with the LMK03806BEVAL/NOPB from Texas Instruments, a top-tier manufacturer known for quality and innovation. This development board offers 14 programmable LVCMOS, LVDS, or LVPECL outputs with ultra-low jitter, providing precise timing for a wide range of applications. Whether you're working on telecommunications, networking, or industrial automation, this evaluation board delivers unmatched value and performance, making it a must-have tool for any engineer looking to optimize their designs.

Feature Benefit Bullets

Other Names: 296-45783 / LMK03806BEVAL/NOPB-ND

Easy to identify and purchase the correct product

Category: Development Boards, Kits, Programmers / Evaluation Boards / Evaluation and Demonstration Boards and Kits

Ideal for testing and evaluating the performance of the LMK03806 chip

Package: Box

Provides convenient storage and protection for the board and cables

Type: Timing

Specifically designed for clock generation applications

Function: Clock Generator

Generates clock signals with precision and reliability

Utilized IC / Part: LMK03806

Compatible with the specified IC for seamless integration

Primary Attributes: 14 Programmable LVCMOS, LVDS or LVPECL Outputs

Offers flexibility in output configurations for different applications

Supplied Contents: Board(s), Cable(s)

Includes essential components for immediate setup and use

Secondary Attributes: Ultra Low Jitter

Ensures minimal signal distortion and high accuracy in timing

Base Product Number: LMK03806

Part of a series of products designed around the LMK03806 chip

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Suitable for various environmental conditions without moisture damage concerns

Technical Specifications

Additional Parts LMK03806BEVAL/NOPB attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-45783
LMK03806BEVAL/NOPB-ND

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Standard Package:

1

Function:

Clock Generator

Type:

Timing

Supplied Contents:

Board(s), Cable(s)

Secondary Attributes:

Ultra Low Jitter

Utilized IC / Part:

LMK03806

Package:

Box

Embedded:

No

Primary Attributes:

14 Programmable LVCMOS, LVDS or LVPECL Outputs

Base Product Number:

LMK03806

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

LMK03806BEVAL/NOPB Miscellaneous Components trade compliance attributes, and parameters.

ECCN

5A991B1

HTS

9030.90.6600

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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