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LMK03200EVAL/NOPB

Texas Instruments

LMK03200EVAL/NOPB by Texas Instruments

LMK03200EVAL/NOPB by Texas Instruments is a Timing Evaluation Board with 3 LVDS and 5 LVPECL Outputs. It features an Integrated PLL and VCO, operating at 3.15V ~ 3.45V Supply. Ideal for clock conditioning applications utilizing the LMK03200 IC, this board is designed for Development and Demonstration purposes.

Median Price

$441.480

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 1 parts In-Stock

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$418.800

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$418.800

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Mouser Electronics

USA . 2 parts In-Stock

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$464.160

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$464.160

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Digiode

USA . 363 parts In-Stock

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$414.438

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$414.438

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Vyrian

USA . 2,146 parts In-Stock

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Component Stockers USA

USA . 603 parts In-Stock

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$99.990

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$99.990

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Semicontronic

India . 3 parts In-Stock

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$355.980

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$347.080

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$345.301

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$355.980

$347.080

$345.301

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Ampacity Inc.

Singapore . 3 parts In-Stock

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$370.810

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$370.810

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Corphita

USA . 1,711 parts In-Stock

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$392.625

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$392.625

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Corohmni

South Africa . 265 parts In-Stock

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$436.250

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$436.250

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Parana Technologies

USA . 1,583 parts In-Stock

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$0.813

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ChromeModa Solutions

Germany . 932 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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DigiPath Technology Company

USA . 423 parts In-Stock

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IDEA Electronic Components Group

UK . 270 parts In-Stock

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Perfect Parts

USA . 4 parts In-Stock

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Overview

Unlock the power of precision timing with the LMK03200EVAL/NOPB by Texas Instruments. This evaluation board offers unparalleled quality and reliability, backed by the trusted name of TI. Ideal for development projects, this board is perfect for applications requiring clock conditioning. With 3 LVDS and 5 LVPECL outputs, an integrated PLL, and VCO, this board provides unmatched performance and versatility. Experience the value and benefits of precise timing control with the LMK03200EVAL/NOPB today.

Feature Benefit Bullets

Package: Box

Provides protection during shipping and storage.

Type: Timing

Essential for precise timing applications.

Function: Clock Conditioner

Helps stabilize and improve clock signals.

Utilized IC / Part: LMK03200

Specifically designed for use with this IC for optimal performance.

Primary Attributes: 3 LVDS and 5 LVPECL Outputs, Integrated PLL and VCO

Offers multiple output options and integrated features for versatile use.

Supplied Contents: Board(s)

Includes all necessary components for immediate use.

Secondary Attributes: 3.15V ~ 3.45V Supply

Provides a stable voltage range for consistent operation.

Base Product Number: LMK03200

Part of a series of products for seamless integration.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Can be stored and used in various environments without risk of moisture damage.

Technical Specifications

Additional Parts LMK03200EVAL/NOPB attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

LMK03200EVAL/NOPB-ND
296-LMK03200EVAL/NOPB
LMK03200EVALNOPB

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Standard Package:

1

Function:

Clock Conditioner

Type:

Timing

Supplied Contents:

Board(s)

Secondary Attributes:

3.15V ~ 3.45V Supply

Utilized IC / Part:

LMK03200

Package:

Box

Embedded:

No

Primary Attributes:

3 LVDS and 5 LVPECL Outputs, Integrated PLL and VCO

Base Product Number:

LMK03200

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

LMK03200EVAL/NOPB Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

9030.90.6600

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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