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LMK03806BISQ/NOPB

Texas Instruments

LMK03806BISQ/NOPB by Texas Instruments

LMK03806BISQ/NOPB by Texas Instruments is a clock generator with a max output frequency of 1300 MHz, operating at temperatures from -40 to 85 °C. It features a square package shape, 64 terminals, and requires a supply voltage b/w 3.15V to 3.45V. Ideal for industrial applications requiring precise clock generation in compact designs.

Median Price

$20.850

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 72,052 parts In-Stock

1+ parts

$17.091

100+ parts

$14.929

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$10.296

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72,052

$17.091

$14.929

$10.296

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DigiKey

USA . 751 parts In-Stock

1+ parts

$24.610

100+ parts

$17.233

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$15.904

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751

$24.610

$17.233

$15.904

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Distributors (In-Stock)

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Digiode

USA . 1,185 parts In-Stock

1+ parts

$16.236

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1,185

$16.236

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Chip Stock

USA . 5,502 parts In-Stock

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5,502

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Vyrian

USA . 4,264 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

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Netsource Technology, Inc.

USA . 148 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 3,302 parts In-Stock

1+ parts

$15.382

100+ parts

-

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$15.382

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Component Stockers USA

USA . 1,113 parts In-Stock

1+ parts

$19.580

100+ parts

$15.420

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1,113

$19.580

$15.420

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Parana Technologies

USA . 860 parts In-Stock

1+ parts

$19.994

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$19.930

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860

$19.994

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$19.930

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ChromeModa Solutions

Germany . 3,320 parts In-Stock

1+ parts

$22.465

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$18.421

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3,320

$22.465

$18.421

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IDEA Electronic Components Group

UK . 1,163 parts In-Stock

1+ parts

$22.465

100+ parts

$21.342

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$20.218

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1,163

$22.465

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$20.218

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Corohmni

South Africa . 2,161 parts In-Stock

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$85.610

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Lixinc

USA . 14,630 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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DigiPath Technology Company

USA . 2,202 parts In-Stock

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$20.254

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Perfect Parts

USA . 1,103 parts In-Stock

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Overview

Unleash the power of precision timing with the LMK03806BISQ/NOPB clock generator from Texas Instruments! Designed for high-performance applications, this square package chip carrier offers a maximum output clock frequency of 1300 MHz to ensure accurate synchronization in industrial settings. With a wide operating temperature range and advanced CMOS technology, this clock generator is perfect for processor-specific peripherals that demand reliable timing solutions. Elevate your designs with Texas Instruments' quality engineering and unlock a world of possibilities with the LMK03806BISQ/NOPB.

Feature Benefit Bullets

Surface Mount: YES

Easy to install and saves space on the PCB.

Maximum Supply Voltage: 3.45 V

Can handle higher voltages, providing stability and reliability.

Package Shape: SQUARE

Uniform shape for easy handling and arrangement on the board.

Maximum Output Clock Frequency: 1300 MHz

High frequency output for high-performance applications.

Power Supplies (V): 3.3

Compatible with common power supply voltages for easy integration.

No. of Terminals: 64

Sufficient terminals for versatile connectivity options.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles for flexibility in design and thermal management.

Minimum Supply Voltage: 3.15 V

Ensures stable operation even at lower supply voltages.

Maximum Operating Temperature: 85 °C

Can operate in higher temperature environments without issues.

Minimum Operating Temperature: -40 °C

Wide operating temperature range for use in various conditions.

Terminal Finish: Matte Tin (Sn)

Durable terminal finish for long-lasting performance.

Terminal Position: QUAD

Quad terminal position for secure and stable connections.

Maximum Seated Height: 0.8 mm

Low profile design for compact and space-saving installations.

Width: 9 mm

Standard width for easy compatibility with PCB layout.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly.

Length: 9 mm

Compact length for efficient use of board space.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with extended temperature ranges.

Peripheral IC Type: CLOCK GENERATOR, PROCESSOR SPECIFIC

Specifically designed for clock generation in processor applications.

Technology: CMOS

CMOS technology for low power consumption and high speed operation.

Terminal Form: NO LEAD

Lead-free terminal form for RoHS compliance and environmental friendliness.

Nominal Supply Voltage: 3.3 V

Stable and common supply voltage for ease of use.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting and connectivity.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for standard handling procedures.

Nominal Primary Clock/Crystal Frequency: 20.5 MHz

Designed for specific clock/crystal frequencies for optimal performance.

Technical Specifications

Clock Generators LMK03806BISQ/NOPB attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

1300 MHz

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Nominal Primary Clock/Crystal Frequency:

20.5 MHz

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Clock Generators

Maximum Supply Voltage:

3.45 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Trade Compliance

LMK03806BISQ/NOPB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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