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LMH1983SQX

Texas Instruments

LMH1983SQX by Texas Instruments

LMH1983SQX by Texas Instruments is a Clock Generator IC with 40 terminals, operating at 3.135-3.465V, suitable for industrial applications. It features a primary clock frequency of 27MHz, CMOS technology, and operates in temperatures ranging from -40 to 85°C. The package style includes chip carrier and very thin profile options for surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,500 parts In-Stock

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Digiode

USA . 2,399 parts In-Stock

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Anansix

USA . 949 parts In-Stock

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949

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One Stop Electronics

USA . 524 parts In-Stock

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$6.000

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$6.000

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AZTECH Wire

Italy . 568 parts In-Stock

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$7.458

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Parana Technologies

USA . 563 parts In-Stock

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$14.991

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$15.416

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$14.991

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ChromeModa Solutions

Germany . 1,619 parts In-Stock

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$16.844

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$13.812

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$16.844

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IDEA Electronic Components Group

UK . 544 parts In-Stock

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$16.844

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$16.002

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$15.160

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544

$16.844

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Corohmni

South Africa . 5,172 parts In-Stock

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$59.947

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Kepictronics

USA . 2,500 parts In-Stock

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Authorized Procurement Solutions

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DigiPath Technology Company

USA . 1,539 parts In-Stock

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$15.187

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Corphita

USA . 1,020 parts In-Stock

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Overview

Elevate your clock generation capabilities with the LMH1983SQX by Texas Instruments. Crafted with precision and expertise, this clock generator offers unparalleled quality and reliability in a compact square package. Ideal for a wide range of applications, this innovative chip carrier features a very thin profile and quad terminal position, ensuring seamless integration into your designs. With a nominal supply voltage of 3.3V and a maximum operating temperature of 85°C, the LMH1983SQX delivers exceptional performance in industrial settings. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and cost in the manufacturing process.

Maximum Supply Voltage: 3.465 V

Allows for a higher voltage input, which can provide better performance and stability for the clock generator.

Package Shape: SQUARE

The square package shape can make the clock generator easier to integrate into a circuit layout, optimizing space efficiency.

No. of Terminals: 40

Having 40 terminals provides ample connectivity options for various external components, increasing versatility in system design.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This combination of package styles offers effective heat dissipation and a compact form factor, ideal for space-constrained applications.

Minimum Supply Voltage: 3.135 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, enhancing the clock generator's flexibility.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this clock generator can reliably function in demanding industrial environments without overheating.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the clock generator to operate effectively in extreme cold conditions, making it suitable for various applications.

Terminal Position: QUAD

Quad terminal positioning simplifies the connection process and improves signal integrity, promoting stable clock signals for the system.

Maximum Seated Height: 0.8 mm

The low seated height enables a slimmer profile for the clock generator, facilitating compact designs in space-sensitive applications.

Width: 6 mm

The compact 6 mm width makes the clock generator easy to integrate into densely populated PCB layouts, optimizing board space usage.

Length: 6 mm

The 6 mm length further enhances the clock generator's space efficiency, allowing for streamlined circuit designs.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade operation, this clock generator can withstand harsh environmental conditions and ensure reliable performance in tough settings.

Peripheral IC Type: CLOCK GENERATOR, VIDEO

This clock generator is specifically tailored for video applications, providing precise and stable clock signals essential for video processing systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, resulting in efficient operation and reliable clock signal generation.

Terminal Form: NO LEAD

The no-lead terminal form simplifies PCB assembly and reduces the risk of solder joint failures, enhancing overall product reliability.

Nominal Supply Voltage: 3.3 V

The 3.3 V nominal supply voltage ensures compatibility with standard power sources, simplifying integration into existing systems.

Terminal Pitch: 0.5 mm

The fine 0.5 mm terminal pitch allows for high-density mounting on the PCB, enabling compact and efficient circuit layouts.

Nominal Primary Clock/Crystal Frequency: 27 MHz

The 27 MHz primary clock frequency is suitable for various applications, offering precise timing signals for optimal system performance.

Technical Specifications

Clock Generators LMH1983SQX attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N40

Length:

6 mm

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Nominal Primary Clock/Crystal Frequency:

27 MHz

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Peripheral IC Type:

Trade Compliance

LMH1983SQX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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