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LMH1983SQ

Texas Instruments

LMH1983SQ by Texas Instruments

LMH1983SQ by Texas Instruments is a clock generator IC with 40 terminals, operating at 3.135-3.465V, suitable for industrial applications. It features a nominal primary clock frequency of 27MHz, CMOS technology, and quad terminal position. This surface-mount chip carrier has a compact square package style with dimensions of 6x6mm and can withstand temperatures from -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,270 parts In-Stock

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Digiode

USA . 1,948 parts In-Stock

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Anansix

USA . 365 parts In-Stock

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365

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AZTECH Wire

Italy . 836 parts In-Stock

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$14.244

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836

$14.244

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One Stop Electronics

USA . 392 parts In-Stock

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$16.000

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392

$16.000

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Parana Technologies

USA . 1,305 parts In-Stock

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$71.439

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$71.439

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DigiPath Technology Company

USA . 228 parts In-Stock

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$78.664

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$72.371

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228

$78.664

$72.371

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Corohmni

South Africa . 15 parts In-Stock

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$79.910

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15

$79.910

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ChromeModa Solutions

Germany . 2,176 parts In-Stock

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$80.269

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$65.821

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$80.269

$65.821

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IDEA Electronic Components Group

UK . 493 parts In-Stock

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$80.269

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$76.256

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$72.242

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493

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$72.242

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A-Z Elektronik GmbH

Germany . 5,657 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,771 parts In-Stock

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Corphita

USA . 1,392 parts In-Stock

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Kepictronics

USA . 33 parts In-Stock

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Overview

Elevate your clock generation capabilities with the LMH1983SQ by Texas Instruments. Designed with precision and quality in mind, this clock generator offers unparalleled performance and reliability for a wide range of applications. From industrial to video peripherals, this versatile chip carrier with a very thin profile delivers optimal functionality and efficiency. Ensure seamless operations with a nominal supply voltage of 3.3V and a maximum seated height of just 0.8mm. Experience the value and benefits of Texas Instruments' expertise in clock generators with the LMH1983SQ.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and convenient installation on circuit boards, saving space and enabling high-density layouts.

Maximum Supply Voltage: 3.465 V

Provides a stable power supply within the specified limit, ensuring proper functionality and longevity of the clock generator.

Package Shape: SQUARE

Square package shape offers uniformity in dimensions, simplifying placement and alignment during assembly.

No. of Terminals: 40

Having 40 terminals allows for multiple connections and configurations, offering versatility in circuit design.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style combination provides efficient heat dissipation, compact size, and low profile, ideal for space-constrained applications.

Minimum Supply Voltage: 3.135 V

With a low minimum supply voltage, the clock generator can operate efficiently even under varying voltage conditions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliability and stability in diverse environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range support enables the clock generator to function reliably in extreme cold environments.

Terminal Position: QUAD

Quad terminal positioning enhances connectivity and ease of integration within circuit layouts, promoting efficient signal transmission.

Maximum Seated Height: 0.8 mm

Low maximum seated height facilitates compact design integration, reducing overall system height and enhancing space utilization.

Width: 6 mm

The 6mm width allows for a streamlined form factor, enabling seamless incorporation into various electronic devices and systems.

Length: 6 mm

With a 6mm length, the clock generator offers a balanced footprint, contributing to overall space-efficient circuit board layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh industrial environments, making it a suitable choice for robust applications.

Peripheral IC Type: CLOCK GENERATOR, VIDEO

Designed as a clock generator with video support, this product is versatile and well-suited for applications requiring synchronized video and clock signals.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, enhancing the overall performance of the clock generator.

Terminal Form: NO LEAD

No-lead terminal form simplifies the soldering process, reduces assembly complexity, and improves overall reliability of the connection.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with standard power sources, making integration and operation seamless.

Terminal Pitch: 0.5 mm

With a small terminal pitch of 0.5mm, the clock generator supports dense packing and enables precise connections in space-constrained applications.

Nominal Primary Clock/Crystal Frequency: 27 MHz

The 27MHz clock/crystal frequency offers high precision and stability, making the clock generator suitable for applications requiring accurate timing synchronization.

Technical Specifications

Clock Generators LMH1983SQ attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N40

Length:

6 mm

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Nominal Primary Clock/Crystal Frequency:

27 MHz

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Peripheral IC Type:

Trade Compliance

LMH1983SQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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