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LM556MDC

Texas Instruments

LM556MDC by Texas Instruments

Texas Instruments' LM556MDC is a dual-function analog waveform generator with a supply voltage range of 4.5V to 16V. Operating b/w 0°C to 70°C, it produces pulse and rectangular waveforms, making it ideal for commercial applications requiring precise signal generation in surface-mount designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,914 parts In-Stock

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3,914

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Anansix

USA . 1,283 parts In-Stock

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1,283

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Digiode

USA . 416 parts In-Stock

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416

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 898 parts In-Stock

1+ parts

$5.500

100+ parts

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898

$5.500

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AZTECH Wire

Italy . 204 parts In-Stock

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$8.518

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204

$8.518

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Parana Technologies

USA . 2,156 parts In-Stock

1+ parts

$9.434

100+ parts

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$10.051

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2,156

$9.434

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$10.051

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DigiPath Technology Company

USA . 1,473 parts In-Stock

1+ parts

$10.388

100+ parts

$9.557

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1,473

$10.388

$9.557

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ChromeModa Solutions

Germany . 1,181 parts In-Stock

1+ parts

$10.600

100+ parts

$8.692

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1,181

$10.600

$8.692

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IDEA Electronic Components Group

UK . 682 parts In-Stock

1+ parts

$10.600

100+ parts

$10.070

1k+ parts

$9.540

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682

$10.600

$10.070

$9.540

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Corphita

USA . 5,270 parts In-Stock

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5,270

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Overview

Unleash the power of analog waveform generation with the LM556MDC by Texas Instruments. Designed with precision and expertise, this surface mount chip offers dual functions for versatile applications. From pulse to rectangular waveforms, this commercial-grade technology delivers consistent performance in a wide range of temperatures. Elevate your projects with the quality and reliability of Texas Instruments, providing unmatched value and benefits to customers looking for top-notch analog waveform generation solutions.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, making it convenient for manufacturing and compact designs.

No. of Functions: 2

Having multiple functions allows for versatile waveform generation, offering more options for signal output.

Nominal Supply Voltage: 5 V

Stable and commonly used supply voltage, ensuring compatibility with standard power sources.

Package Style: UNCASED CHIP

Uncased chip package style provides flexibility for custom mounting options and reduces overall size.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for operation in a wide range of environments, from cold to hot.

Terminal Position: UPPER

Upper terminal position simplifies connections and layout, enhancing ease of use during installation.

Other IC type: PULSE; RECTANGULAR

Support for pulse and rectangular waveforms expands the range of signals that can be generated, increasing functionality.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage requirement enables operation in systems with limited power availability.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating conditions in non-industrial settings.

Technology: BIPOLAR

Bipolar technology offers high precision and accuracy in waveform generation, suitable for applications requiring signal fidelity.

Terminal Form: NO LEAD

No lead terminal form simplifies assembly and reduces the risk of soldering errors during installation.

Maximum Supply Voltage: 16 V

High maximum supply voltage tolerance allows for operation in systems with higher power requirements without risk of damage.

Technical Specifications

Analog Waveform Generation LM556MDC attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

X-XUUC-N

No. of Functions:

2

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

LM556MDC Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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